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1N5408RL PDF预览

1N5408RL

更新时间: 2024-02-05 05:44:33
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 46K
描述
Axial-Lead Standard Recovery Rectifiers

1N5408RL 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:ActiveReach Compliance Code:not_compliant
HTS代码:8541.10.00.80风险等级:5.09
应用:GENERAL PURPOSE外壳连接:ISOLATED
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODEJEDEC-95代码:DO-201AD
JESD-30 代码:O-PALF-W2JESD-609代码:e0
最大非重复峰值正向电流:200 A元件数量:1
相数:1端子数量:2
最大输出电流:3 A封装主体材料:PLASTIC/EPOXY
封装形状:ROUND封装形式:LONG FORM
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
最大重复峰值反向电压:1000 V表面贴装:NO
端子面层:Tin/Lead (Sn/Pb)端子形式:WIRE
端子位置:AXIAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

1N5408RL 数据手册

 浏览型号1N5408RL的Datasheet PDF文件第2页浏览型号1N5408RL的Datasheet PDF文件第3页浏览型号1N5408RL的Datasheet PDF文件第4页浏览型号1N5408RL的Datasheet PDF文件第5页浏览型号1N5408RL的Datasheet PDF文件第6页 
1N5400 thru 1N5408  
1N5404 and 1N5406 are Preferred Devices  
Axial−Lead Standard  
Recovery Rectifiers  
Lead mounted standard recovery rectifiers are designed for use in  
power supplies and other applications having need of a device with the  
following features:  
http://onsemi.com  
Features  
High Current to Small Size  
High Surge Current Capability  
Low Forward Voltage Drop  
Void−Free Economical Plastic Package  
Available in Volume Quantities  
Plastic Meets UL 94 V−0 for Flammability  
STANDARD RECOVERY  
RECTIFIERS  
50−1000 VOLTS  
3.0 AMPERES  
These devices are manufactured with a Pb−Free external lead  
finish only*  
Mechanical Characteristics  
AXIAL LEAD  
CASE 267−05  
STYLE 1  
Case: Epoxy, Molded  
Weight: 1.1 gram (approximately)  
Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
Lead and Mounting Surface Temperature for Soldering Purposes:  
220°C Max. for 10 Seconds, 1/16from case  
MARKING DIAGRAM  
Polarity: Cathode Indicated by Polarity Band  
AL  
1N  
540x  
YYWW  
AL  
= Assembly Location  
1N540x = Device Number  
x
YY  
WW  
= 0, 1, 2, 4, 6, 7 or 8  
= Year  
= Work Week  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
Preferred devices are recommended choices for future use  
and best overall value.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
December, 2004 − Rev. 6  
1N5400/D  

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