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1812SMS-68NJLB PDF预览

1812SMS-68NJLB

更新时间: 2024-01-04 16:15:22
品牌 Logo 应用领域
威讯 - RFMD 放大器电感器测试射频感应器脉冲功率放大器
页数 文件大小 规格书
10页 871K
描述
280W GaN Wideband Pulsed Power Amplifier

1812SMS-68NJLB 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:1925
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8504.50.80.00风险等级:5.7
Is Samacsys:N大小写代码:1925
构造:Flat Top型芯材料:AIR
直流电阻:0.0082 Ω标称电感 (L):0.068 µH
电感器应用:RF INDUCTOR电感器类型:GENERAL PURPOSE INDUCTOR
JESD-609代码:e1功能数量:1
端子数量:2最高工作温度:140 °C
最低工作温度:-40 °C封装高度:4.2 mm
封装长度:4.95 mm封装形式:SMT
封装宽度:6.35 mm包装方法:TR, 7 Inch
最小质量因数(标称电感时):100自谐振频率:0.0015 MHz
形状/尺寸说明:RECTANGULAR PACKAGE屏蔽:NO
表面贴装:YES端子面层:Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
端子位置:DUAL ENDED端子形状:FLAT
测试频率:150 MHz容差:5%
Base Number Matches:1

1812SMS-68NJLB 数据手册

 浏览型号1812SMS-68NJLB的Datasheet PDF文件第4页浏览型号1812SMS-68NJLB的Datasheet PDF文件第5页浏览型号1812SMS-68NJLB的Datasheet PDF文件第6页浏览型号1812SMS-68NJLB的Datasheet PDF文件第8页浏览型号1812SMS-68NJLB的Datasheet PDF文件第9页浏览型号1812SMS-68NJLB的Datasheet PDF文件第10页 
RFHA1025  
Bias Instruction for RFHA1025 Evaluation Board  
ESD Sensitive Material. Please use proper ESD precautions when handling devices of evaluation board. Evaluation board  
requires additional external fan cooling. Connect all supplies before powering evaluation board.  
1. Connect RF cables at RFIN and RFOUT.  
2. Connect ground to the ground supply terminal, and ensure that both the VG and VD grounds are also connected to this  
ground terminal.  
3. Apply -8V to VG.  
4. Apply 50V to VD.  
5. Increase VG until drain current reaches 440mA or desired bias point.  
6. Turn on the RF input.  
IMPORTANT NOTE: Depletion mode device; when biasing the device, VG must be applied before VD. When removing bias, VD  
must be removed before VG is removed. Failure to follow this sequence will cause the device to fail.  
NOTE: For optimal RF performance, consistent and optimal heat removal from the base of the package is required. A thin layer  
of thermal grease should be applied to the interface between the base of the package and the equipment chassis. It is recom-  
mended that a small amount of thermal grease is applied to the underside of the device package. Even application and  
removal of excess thermal grease can be achieved by spreading the thermal grease using a razor blade. The package should  
then be bolted to the chassis and input and output leads soldered to the circuit board  
.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical  
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.  
DS120928  
7 of 10  

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