1500W 15BJxx(C)A-AU Series
JieJie Microelectronics CO., Ltd.
SOLDERING PARAMETERS
Pb-Free assembly
Reflow Condition
(see figure at right)
-Temperature Min (Ts(min)
-Temperature Max(Ts(max)
-Time (Min to Max) (ts)
)
+150℃
Pre
)
+200℃
Heat
60-180 secs.
Reflow condition
tp
Average ramp up rate (Liquidus Temp
(TL)to peak)
TP
3℃/sec. Max
Critical Zone
Ramp-up
TL to TP
TL
tL
Ts(max) to TL - Ramp-up Rate
3℃/sec. Max
+217℃
TS(max)
Ramp-down
-Temperature(TL)(Liquidus)
Reflow
Preheat
TS(min)
ts
-Temperature(tL)
60-150 secs.
+260(+0/-5)℃
20-40secs.
6℃/sec. Max
8 min. Max
+260℃
Peak Temp (Tp)
25
time to peak temperatue
Time
(t 25℃ to peak)
Time within 5℃of actual Peak Temp (tp)
Ramp-down Rate
Time 25℃to Peak Temp (TP)
Do not exceed
PACKAGE MECHANICAL DATA
B
Dimensions
Ref.
Millimeters
Inches
Min. Max.
Min.
3.90
4.65
1.85
0.60
5.60
2.05
0.12
2.00
Max.
4.50 0.154 0.177
5.15 0.183 0.203
2.15 0.073 0.085
0.024
A
B
C
D
E
F
G
J
E
D
6.00
0.220 0.236
2.35 0.081 0.093
0.28 0.005 0.011
0.079
J
K
J
3.20
0.126
K
L
2.30
0.091
SMBF
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