Datasheet > 12062R104M8BB0G

12062R104M8BB0G

更新时间： 2023-01-02 23:01:36

品牌	Logo	应用领域
国巨 - YAGEO		/
页数	文件大小	规格书
14页	272K
描述
Feed Through Capacitor, 1 Function(s), 25V, EIA STD PACKAGE SIZE 1206, 4 PIN

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12062R104M8BB0G 数据手册

Phycomp

Product specification

Surface-mount ceramic

multilayer capacitors

Class 2, X7R 16/25/50 V

feedthrough

TESTS AND REQUIREMENTS

Table 3 Test procedures and requirements

IEC

60384-10/

CECC 32 100

CLAUSE

60068-2

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

4.4

mounting

the capacitors may be mounted

on printed-circuit boards or

no visible damage

ceramic substrates by applying

wave soldering, reflow soldering

(including vapour phase

soldering) or conductive adhesive

4.5

visualinspectionand any applicable method using

in accordance with specification

within specified tolerance

dimension check

×10 magnification

4.6.1

4.6.2

capacitance

f = 1 kHz; measuring voltage

1 V_rmsat 20 °C

tan δ

f = 1 kHz; measuring voltage

in accordance with specification

1 V_rmsat 20 °C

4.6.3

4.6.4

4.7.2

insulation resistance at U_R(DC) for 1 minute

in accordance with specification

no breakdown or flashover

voltage proof

2.5 × U_Rfor 1 minute

temperature

coefficient

between minimum and

maximum temperature

in accordance with specification

4.8

adhesion

a force of 5 N applied for 10 s to no visible damage

the line joining the terminations

and in a plane parallel to the

substrate

4.9

bond strength of

plating on end face

mounted in accordance with

CECC 32 100, paragraph 4.4

no visible damage

conditions: bending

1 mm at a rate of 1 mm/s,

radius jig 340 mm

∆C/C: ≤10%

4.10

resistance to

soldering heat

260 5 °C for 10 0.5 s

in a static solder bath

the terminations shall be well

tinned after recovery

∆C/C: > −5% and ≤ +10%

whichever is greater

resistance to

leaching

260 5 °C for 30 1 s

in a static solder bath

using visual enlargement of

×10, dissolution of the

terminations shall not

exceed 10%

4.11

solderability

zero hour test, and test after

storage (20 to 24 months) in

original packing in normal

atmosphere;

the terminations shall be well

tinned ≥95%

unmounted chips completely

immersed for 2 0.5 s

in a solder bath at 235 5 °C

2001 May 30 Rev.3

www.phycomp-components.com

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