Phycomp
Product specification
Surface-mount ceramic
multilayer capacitors
Class 2, Y5V
16/25/50 V
TESTS AND REQUIREMENTS
Table 2 Test procedures and requirements
IEC
IEC
60384-10/
CECC 32 100
CLAUSE
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
4.4
mounting
the capacitors may be mounted
on printed-circuit boards or
ceramic substrates by applying
wave soldering, reflow soldering
(including vapour phase
soldering) or conductive
adhesive
no visible damage
4.5
visual inspection and any applicable method using ×10 in accordance with
dimension check
magnification
specification
4.6.1
4.6.2
capacitance
f = 1 kHz; Y5V measuring
voltage 1 Vrms at 25 °C
within specified tolerance
tan δ
f = 1 kHz; Y5V measuring
voltage 1 Vrms at 25 °C
in accordance with
specification
at UR (DC) for 1 minute
RiCR ≥500 s
4.6.3
4.6.4
4.7.1
insulation resistance
voltage proof
2.5 × UR for 1 minute
no breakdown or flashover
temperature
coefficient
between minimum and maximum in accordance with
temperature
specification
4.8
adhesion
a force of 5 N applied for 10 s to
the line joining the terminations
and in a plane parallel to the
substrate
no visible damage
4.9
bond strength of
plating on end face
mounted in accordance with IEC
60384-1, paragraph 4.35
no visible damage
conditions:
∆C/C: ≤30%
bending 1 mm at a rate of 1
mm/s, radius jig 340 mm
4.10
Tb
resistance to
soldering heat
preconditioning:
the terminations shall be
well tinned
after recovery ∆C/C: ±20%
120 to 150 °C during 1 minute;
260 ±5 °C for 10 ±0.5 s in a
static solder bath
tan δ: original specification
Rins: original specification
resistance to
leaching
260 ±5 °C for 30 ±1 s
in a static solder bath
using visual enlargement
of ×10, dissolution of the
terminations shall not
exceed 10%
2003 Jul 08 Rev.7
9
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