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1110IBZ

更新时间： 2024-02-05 11:14:20
品牌 Logo 应用领域
英特矽尔 - INTERSIL /
页数 文件大小 规格书
9页 185K
描述
750MHz, Low Distortion Unity Gain, Closed Loop Buffer

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1110IBZ 技术参数

生命周期：Obsolete包装说明：R-XDIP-W4
Reach Compliance Code：unknownHTS代码：8541.10.00.80
风险等级：5.56配置：BRIDGE, 4 ELEMENTS
二极管元件材料：SILICON二极管类型：BRIDGE RECTIFIER DIODE
最大正向电压 (VF)：1.7 VJESD-30 代码：R-XDIP-W4
最大非重复峰值正向电流：25 A元件数量：4
相数：1端子数量：4
最高工作温度：150 °C最大输出电流：1.4 A
封装主体材料：UNSPECIFIED封装形状：RECTANGULAR
封装形式：IN-LINE认证状态：Not Qualified
最大重复峰值反向电压：1000 V最大反向恢复时间：0.07 µs
子类别：Bridge Rectifier Diodes表面贴装：NO
端子形式：WIRE端子位置：DUAL
Base Number Matches：1

1110IBZ 数据手册

 浏览型号1110IBZ的Datasheet PDF文件第3页浏览型号1110IBZ的Datasheet PDF文件第4页浏览型号1110IBZ的Datasheet PDF文件第5页浏览型号1110IBZ的Datasheet PDF文件第6页浏览型号1110IBZ的Datasheet PDF文件第7页浏览型号1110IBZ的Datasheet PDF文件第8页 
HFA1110  
Small Outline Plastic Packages (SOIC)  
M8.15 (JEDEC MS-012-AA ISSUE C)  
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE  
N
INDEX  
AREA  
0.25(0.010)  
M
B M  
H
INCHES MILLIMETERS  
E
SYMBOL  
MIN  
MAX  
MIN  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
MAX  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
NOTES  
-B-  
A
A1  
B
C
D
E
e
0.0532  
0.0040  
0.013  
0.0688  
0.0098  
0.020  
-
-
1
2
3
L
9
SEATING PLANE  
A
0.0075  
0.1890  
0.1497  
0.0098  
0.1968  
0.1574  
-
-A-  
3
h x 45°  
D
4
-C-  
0.050 BSC  
1.27 BSC  
-
α
H
h
0.2284  
0.0099  
0.016  
0.2440  
0.0196  
0.050  
5.80  
0.25  
0.40  
6.20  
0.50  
1.27  
-
e
A1  
C
5
B
0.10(0.004)  
L
6
0.25(0.010) M  
C
A M B S  
N
α
8
8
7
NOTES:  
0°  
8°  
0°  
8°  
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication Number 95.  
Rev. 1 6/05  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006  
inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. Inter-  
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per  
side.  
5. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
above the seating plane, shall not exceed a maximum value of  
0.61mm (0.024 inch).  
10. Controlling dimension: MILLIMETER. Converted inch dimensions  
are not necessarily exact.  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN2944.8  
June 6, 2006  
9
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