M u l t i - C a v i t y S l o t - L o k ™ Isolate multiple components in one shield
A Low-Cost, Multi-Cavity Alternative
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Multi-Cavity / Slot-Lok
Specs
The proprietary and extremely cost-effective Slot-Lok™ design and
manufacturing process can accommodate virtually any multi-cavity shielding
application requirement. This circuit board shield uses a flexible manufacturing
technology that increases design options while reducing lead time and total
product cost.
Sizes: .50” x 12.00”
Shapes: Squares, Rectangles and Odd Shapes
Heights: <.150” to 2.00”
Material Thickness: .010” (,25), .012” (,31) or .015” (,38)
Std Material: Alloy 770
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Cover Retention: 1.5 - 2.5 lb./linear inch
Multi-Cavity Slot Lok Features and Benefits
Shielding Effectiveness: up to 60 dB
• Minimal NRE
• Short lead time
Standard Options
• Surface mount or through-hole design
• Pin pitch matching - to replace existing “legacy” shields
• E-Z pull tabs for ease of cover removal
• Removable cover for access to components
• Cover retention using standard locking and grounding dimples
• Proven multi-cavity performance with interlocking corners
• Multiple level shields
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Welded partitions
Mouse holes, notches, ventilation, standoffs
Welded fence assembly
Pick & place spot
Custom packaging: tape & reel, vacuum trays
Material Options
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Pre-tin plated Phos Bronze
Pre-tin plated steel
Finish Plating Options
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Bright tin
Matte tin
Tin lead (not RoHS compliant)
Nickel
The Leading Edge in EMI Shielding Technology
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