Datasheet > 10M02SCU169C8G

10M02SCU169C8G

更新时间： 2024-01-30 12:09:14

品牌	Logo	应用领域
英特尔 - INTEL		时钟栅可编程逻辑
页数	文件大小	规格书
14页	604K
描述
Field Programmable Gate Array, PBGA169, 11 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, UBGA-169

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技术参数
数据手册

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10M02SCU169C8G 技术参数

是否Rohs认证：	符合	生命周期：	Transferred
包装说明：	BGA,	Reach Compliance Code：	compliant
风险等级：	5.73	JESD-30 代码：	S-PBGA-B169
端子数量：	169	最高工作温度：	85 °C
最低工作温度：		封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA	封装形状：	SQUARE
封装形式：	GRID ARRAY	峰值回流温度（摄氏度）：	NOT SPECIFIED
可编程逻辑类型：	FIELD PROGRAMMABLE GATE ARRAY	表面贴装：	YES
温度等级：	OTHER	端子形式：	BALL
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	NOT SPECIFIED
Base Number Matches：	1

10M02SCU169C8G 数据手册

M10-OVERVIEW

2014.09.22

Power Management

Feature

Description

Instant-on

Provides the fastest power-up mode for MAX 10 devices without any

POR delay

Table 13: Configuration Modes for MAX 10 Devices

Configuration Mode

Compression

Encryption

Dual Image

Configuration

Data Width

Internal Configuration

JTAG

Yes

—

Yes

—

Yes

—

Power Management

Table 14: Power Options

Power Options

Advantage

Single supply device option

Dual supply device option

Saves board space and costs

•

Consumes less power than the single supply device option

Offers higher performance than the single supply device option

Power management controller

scheme

•

Reduces dynamic power consumption when certain applications

are in standby mode

Provides a fast wake-up time of less than 1 ms.

Document Revision History for MAX 10 FPGA Device Overview

Date

Version

Changes

September 2014

2014.09.22 Initial release.

MAX 10 FPGA Device Overview

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