Datasheet > 0RQB-X0S11L

0RQB-X0S11L

更新时间： 2022-02-26 10:17:18

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0RQB-X0S11L 数据手册

0RQB-X0S11x

Thermal Considerations

New high power architectures require an accurate thermal design. Design engineers have to optimize the module working conditions

and ensure reliable operation. Convection cooling is the common mode to cool down the module.

Heat transfer is dependent on a test setup and it is important to characterize the module in an environment similar to existent

electronic applications.

Reported thermal data reflects real operating conditions because the values are physically measured in a wind tunnel.

Thermal Test Setup

A module in electronic cards is typically located in a busy area without relevant space around it. To simulate a real condition and

avoid turbulence we add a cover with defined dimensions.

The distance has to be 6.35mm (0.25”inch) from the top of the module and 6.35mm (0.25”inch) on the left and right side of the

module.

The values reflect most of the real applications and it is a common procedure in the power module market.

Ambient temperature and airflow are measured in front of the module at the distance of 76.2 mm (3 inch).

For 0RQB-X0S11 A/B

tech.support@psbel.com

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