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0805N6R8B501 PDF预览

0805N6R8B501

更新时间: 2024-04-09 18:48:38
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
12页 3527K
描述
0805, NPO, 6.8pF, 500Vdc

0805N6R8B501 数据手册

 浏览型号0805N6R8B501的Datasheet PDF文件第6页浏览型号0805N6R8B501的Datasheet PDF文件第7页浏览型号0805N6R8B501的Datasheet PDF文件第8页浏览型号0805N6R8B501的Datasheet PDF文件第9页浏览型号0805N6R8B501的Datasheet PDF文件第10页浏览型号0805N6R8B501的Datasheet PDF文件第11页 
Multilayer Ceramic Capacitors  
Approval Sheet  
Recommended soldering conditions  
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable  
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and  
concentration of N2 within oven are recommended.  
Fig. 6 Recommended reflow soldering profile for SMT process  
with SnAgCu series solder paste.  
Fig. 7 Recommended wave soldering profile for SMT process  
with SnAgCu series solder.  
Page 12 of 12  
ASC_Middle & High Voltage  
Jul. 2023  

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