Surface Mounting Guide
MLC Chip Capacitors
Wave
APPLICATION NOTES
300
Storage
Preheat
Natural
Cooling
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
250
200
150
100
50
T
Solderability
230°C
to
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
250°C
Leaching
Terminations will resist leaching for at least the immersion
times and conditions shown below.
Solder
Tin/Lead/Silver Temp. °C
60/40/0 260 ± 5
Solder
Immersion Time
Seconds
0
Termination Type
1 to 2 min
3 sec. max
Nickel Barrier
30 ± 1
(Preheat chips before soldering)
T/maximum 150°C
Recommended Soldering Profiles
Lead-Free Wave Soldering
The recommended peak temperature for lead-free wave
soldering is 250°C-260°C for 3-5 seconds. The other para-
meters of the profile remains the same as above.
Reflow
300
Natural
Cooling
Preheat
The following should be noted by customers changing from
lead based systems to the new lead free pastes.
250
200
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as
bright as with tin-lead pastes and the fillet may not be as
large.
220°C
to
250°C
150
100
50
b) Resin color may darken slightly due to the increase in
temperature required for the new pastes.
c) Lead-free solder pastes do not allow the same self align-
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
0
1min
(Minimize soldering time)
10 sec. max
1min
General
Surface mounting chip multilayer ceramic capacitors
are designed for soldering to printed circuit boards or other
substrates. The construction of the components is such that
they will withstand the time/temperature profiles used in both
wave and reflow soldering methods.
Lead-Free Reflow Profile
300
250
200
150
100
Handling
Chip multilayer ceramic capacitors should be handled with
care to avoid damage or contamination from perspiration
and skin oils. The use of tweezers or vacuum pick ups
is strongly recommended for individual components. Bulk
handling should ensure that abrasion and mechanical shock
are minimized. Taped and reeled components provides the
ideal medium for direct presentation to the placement
machine. Any mechanical shock should be minimized during
handling chip multilayer ceramic capacitors.
50
0
0
50
100
150
200
250
300
Time (s)
• Pre-heating: 150°C 15°C / 60-90s
• Max. Peak Gradient 2.5°C/s
• Peak Temperature: 245°C 5°C
• Time at >230°C: 40s Max.
Preheat
It is important to avoid the possibility of thermal shock during
soldering and carefully controlled preheat is therefore
required. The rate of preheat should not exceed 4°C/second
71
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