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08051J3R9C4TTR PDF预览

08051J3R9C4TTR

更新时间: 2023-12-06 19:39:42
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX /
页数 文件大小 规格书
18页 1525K
描述
Thin Film Capacitor

08051J3R9C4TTR 数据手册

 浏览型号08051J3R9C4TTR的Datasheet PDF文件第12页浏览型号08051J3R9C4TTR的Datasheet PDF文件第13页浏览型号08051J3R9C4TTR的Datasheet PDF文件第14页浏览型号08051J3R9C4TTR的Datasheet PDF文件第15页浏览型号08051J3R9C4TTR的Datasheet PDF文件第17页浏览型号08051J3R9C4TTR的Datasheet PDF文件第18页 
Thin-Film RF/Microwave Capacitor Technology  
Automotive Grade Accu-P® Series  
Application Notes  
GENERAL  
COMPONENT PAD DESIGN  
Accu-P® SMD capacitors are designed for soldering to printed circuit boards  
or other substrates. The construction of the components is such that they  
will withstand the time/temperature profiles used in both wave and reflow  
soldering methods.  
Component pads must be designed to achieve good joints and minimize  
component movement during reflow soldering. Pad designs are given  
below for both wave and reflow soldering.  
The basis of these designs is:  
a. Pad width equal to component width. It is permissible to decrease this  
to as low as 85% of component width but it is not advisable to go below  
this.  
b. Pad overlap 0.5mm beneath large components. Pad overlap about  
0.3mm beneath small components.  
c. Pad extension of 0.5mm for reflow of large components and pad  
extension about 0.3mm for reflow of small components. Pad extension  
about 1.0mm for wave soldering.  
CIRCUIT BOARD TYPE  
The circuit board types which may be used with Accu-P® are as follows:  
All flexible types of circuit boards  
(eg. FR-4, G-10) and also alumina.  
For other circuit board materials, please consult factory.  
HANDLING  
SMD capacitors should be handled with care to avoid damage or  
contamination from perspiration and skin oils. The use of plastic tipped  
tweezers or vacuum pick-ups is strongly recommended for individual  
components. Bulk handling should ensure that abrasion and mechanical  
shock are minimized. For automatic equipment, taped and reeled product  
gives the ideal medium for direct presentation to the placement machine.  
REFLOW SOLDERING PAD DIMENSIONS: millimeters (inches)  
0402  
0603  
0805  
Accu-P®  
Accu-P®  
Accu-P®  
0.6  
(0.024)  
0.85  
(0.033)  
1.0  
(0.039)  
1.7  
0.5  
2.3  
0.6  
(0.068) (0.020)  
(0.091) (0.024)  
3.0  
1.0  
0.6  
(0.024)  
(0.118) (0.039)  
0.85  
(0.033)  
0.55  
(0.022)  
0.8 (0.031)  
1.0  
(0.039)  
1.25 (0.049)  
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available  
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.  
41  
TDS-RFM-0041 | Rev 1  
rf microwave products  

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