Datasheet > 0685P3500-01

0685P3500-01

更新时间： 2022-05-14 22:16:06

品牌	Logo	应用领域
BEL		/
页数	文件大小	规格书
4页	649K
描述
Surface Mount Fast Acting Chip Fuse

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0685P3500-01 数据手册

3 / 4

Type 0685P

Environmental Specifications

High temperature storage MIL-STD-202 Method 108

MIL-STD-202G, Method 213B, Test Condition 1

Shock Resistance

(100 G's peak for 6 milliseconds; Sawtooth

waveform)

Temperature cycling

Biased humidity

JESD22 Method JA-104,Test Condition B

MIL-STD-202 Method 103, 85C/85% RH with

10% operating power for 1000 hrs.

MIL-STD-202G, Method 201A (10-55 Hz, 0.06

inch, total excursion).

MIL-STD-202G, Method 101E, Test Condition B

(48 hrs.).

MIL-STD-202G, Method 302, Test Condition A

(After Opening) 10,000 ohms minimum.

Vibration Resistance

Salt Spray Resistance

Operational life

Resistance to solvents

Mechanical shock

Vibration

MIL-STD-202 Method 108, Test Condition D

MIL-STD-202 Method 215

Insulation Resistance

Solderability

MIL-STD-202 Method 213,Test Condition C

MIL-STD-202 Method 204

MIL-STD-202G, Method 208H

MIL-STD-202G, Method 210F, Test Condition C.

Resistance to soldering

heat

MIL-STD-202 Method 210,Test condition B

Top Side(260

MIL-STD-202G, Method 210F, Test Condition D.

Bottom Side(260 ,10 sec)

MIL-STD-202G, Method 107G, Test Condition B

(-65 to +125 ).

℃,20 sec)

Resistance to solder

Heat

Thermal shock

Solderability

MIL-STD-202 Method 107

J-STD-002

℃

Board flex(SMD)

Terminal strength

AEC-Q200-005

Thermal Shock

℃

AEC-Q200-006

Operating

-55℃ to +125℃

Temperature

Moisture Sensitivity

Level

Electrical characterization 3 temperature electrical

1 (According to IPC J-Std-020)

Soldering Parameters

IR Reflow Profile (IPC/JEDEC J-STD-020D)

Preheat & Soak

150℃

Temperature min (T_smin

)

Temperature max (T_smax

Time (T_sminto T_smax) (t_s)

)

200℃

60-120 seconds

3℃/second max.

Average ramp-up rate (T_smaxto T_p)

Liquidous temperature (T_L)

Time at liquidous (t_L)

217℃

60-150 seconds

260℃ max

Peak temperature (T_p)

Time (tp) within 5℃ of the specified

classification temperature (Tc)

30 seconds

6℃/second max.

Average ramp-down rate (T_pto T_smax

)

8 minutes max.

Time 25℃ to peak temperature

Lead-free Wave Soldering Profile

Wave Soldering Parameter

Average ramp-up rate

200℃ / second

typical 1 - 2℃ / second

Max 4℃ / second

Heating rate during preheat

within 125℃ of soldering

temperature

Final preheat temperature

Peak temperature Tp

260℃

Time within +0℃ / -5℃ of actual

peak temperature

10 seconds

5℃ / second max.

Ramp-down rate

Specifications subject to change without notice

Bel Fuse Inc.

206 Van Vorst Street

+1 201.432.0463

Bel.US.CS@belf.com

Jersey City, NJ 07302 USA

belfuse.com/circuit-protection

Rev. 0685PApr2021

1 234

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