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06123C223MAT2U PDF预览

06123C223MAT2U

更新时间: 2024-02-14 11:46:39
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX /
页数 文件大小 规格书
4页 321K
描述
Low Inductance Capacitors

06123C223MAT2U 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:, 0612Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:10 weeks
风险等级:5.84电容:0.022 µF
电容器类型:CERAMIC CAPACITOR自定义功能:Contact Factory For Additional Values
介电材料:CERAMIC高度:1.02 mm
JESD-609代码:e3长度:1.6 mm
多层:Yes负容差:20%
端子数量:2最高工作温度:125 °C
最低工作温度:-55 °C封装形式:SMT
包装方法:TR, 7 Inch正容差:20%
额定(直流)电压(URdc):25 V系列:0612 (25V,W TK)
尺寸代码:0612温度特性代码:X7R
温度系数:-/+15ppm/Cel ppm/ °C端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
宽度:3.2 mmBase Number Matches:1

06123C223MAT2U 数据手册

 浏览型号06123C223MAT2U的Datasheet PDF文件第1页浏览型号06123C223MAT2U的Datasheet PDF文件第3页浏览型号06123C223MAT2U的Datasheet PDF文件第4页 
Low Inductance Capacitors  
Introduction  
LAND GRID ARRAY (LGA) CAPACITORS  
LOW INDUCTANCE CHIP ARRAYS (LICA®)  
Land Grid Array (LGA) capacitors are based on the first Low  
ESL MLCC technology created to specifically address the  
design needs of current day Power Delivery Networks (PDNs).  
This is the 3rd low inductance capacitor technology  
developed by AVX. LGA technology provides engineers with  
new options. The LGA internal structure and manufacturing  
technology eliminates the historic need for a device to be  
physically small to create small current loops to minimize  
inductance.  
The LICA® product family is the result of a joint development  
effort between AVX and IBM to develop a high performance  
MLCC family of decoupling capacitors. LICA was introduced  
in the 1980s and remains the leading choice of designers in  
high performance semiconductor packages and high  
reliability board level decoupling applications.  
LICA® products are used in 99.999% uptime semiconductor  
package applications on both ceramic and organic  
substrates. The C4 solder ball termination option is the  
perfect compliment to flip-chip packaging technology.  
Mainframe class CPUs, ultimate performance multi-chip  
modules, and communications systems that must have the  
reliability of 5 9s use LICA®.  
LICA® products with either Sn/Pb or Pb-free solder balls are  
used for decoupling in high reliability military and aerospace  
applications. These LICA® devices are used for decoupling of  
large pin count FPGAs, ASICs, CPUs, and other high power  
ICs with low operating voltages.  
The first family of LGA products are 2 terminal devices. A  
2 terminal 0306 LGA delivers ESL performance that is equal  
to or better than an 0306 8 terminal IDC. The 2 terminal 0805  
LGA delivers ESL performance that approaches the 0508  
8 terminal IDC. New designs that would have used 8 terminal  
IDCs are moving to 2 terminal LGAs because the layout is  
easier for a 2 terminal device and manufacturing yield is better  
for a 2 terminal LGA versus an 8 terminal IDC.  
LGA technology is also used in a 4 terminal family of products  
that AVX is sampling and will formerly introduce in 2008.  
Beyond 2008, there are new multi-terminal LGA product  
families that will provide even more attractive options for PDN  
designers.  
When high reliability decoupling applications require the very  
lowest ESL capacitors, LICA® products are the best option.  
470 nF 0306 Impedance Comparison  
1
0306 2T-LGA  
0306 LICC  
0306 8T-IDC  
0603 MLCC  
0.1  
0.01  
0.001  
1
10  
100  
1000  
Frequency (MHz)  
Figure 2 MLCC, LICC, IDC, and LGA technologies deliver different levels of equivalent series inductance (ESL).  
60  

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