0454001.MR

更新时间： 2024-02-09 04:55:11

品牌	Logo	应用领域
力特 - LITTELFUSE		电熔丝电路保护 PC
页数	文件大小	规格书
3页	190K
描述
Surface Mount Fuses NANO2Â® > Slo-BloÂ® > 452/454 Series

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技术参数
数据手册

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0454001.MR 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
ECCN代码：	EAR99	风险等级：	5.72
电路保护类型：	ELECTRIC FUSE	Base Number Matches：	1

0454001.MR 数据手册

Surface Mount Fuses

Introduction to Circuit Protection

NANO^2®> Slo-Blo > 452/454 Series

Transientology

Temperature Rerating Curve

AverageTime Current Curves

100

Note:

ꢇꢋꢀ %FSBUJOHꢀEFQJDUFEꢀJOꢀUIJTꢀDVSWFꢀJTꢀJOꢀBEEJUJPOꢀUPꢀUIFꢀTUBOEBSEꢀEFSBUJOHꢀPGꢀꢈꢆꢊꢀGPSꢀ

continuous operation.

0.1

0.01

0.1

100

1000

CURRENT IN AMPS

Soldering Parameters

t_P

Reﬂow Condition

-Temperature Min (T_s(min)

Pb – Free assembly

T_P

Critical Zone

T_Lto T_P

Ramp-up

)

ꢇꢆꢉ¡$ꢀ

T_L

Pre Heat -Temperature Max (T_s(max)

-Time (Min to Max) (t_s)

)

ꢈꢉꢉ¡$

t_L

T_S(max)

60 – 120 secs

Ramp-down

Average ramp up rate (LiquidusTemp

(T_L) to peak

Preheat

ꢆ¡$ꢎTFDPOEꢀNBYꢋ

T_S(min)

t_S

T_S(max)toT_L- Ramp-up Rate

ꢆ¡$ꢎTFDPOEꢀNBYꢋ

ꢈꢇꢅ¡$ꢀ

-Temperature (T_L) (Liquidus)

Reﬂow

time to peak temperature

(t 25ºC to peak)

-Temperature (t_L)

60 – 90 seconds

ꢈꢆꢉ^{ꢔꢉꢎꢁꢆ}ꢀ¡$

Time

PeakTemperature (T_P)

Time within 5°C of actual peak

Temperature (t_p)

20 – 40 seconds

Ramp-down Rate

ꢆ¡$ꢎTFDPOEꢀNBYꢋ

8 minutes max.

ꢈꢐꢉ¡$

Time 25°C to peakTemperature (T_P)

Do not exceed

ꢈꢐꢉ¡$ꢀ1FBLꢀ

Temperature,

ꢄꢀTFDPOETꢀNBYꢋ

Wave Soldering Parameters

452/454 Series

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com/series/452.html

or /454.html for current information.

123

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