Datasheet > 02150.16MXESPP

02150.16MXESPP

更新时间： 2024-02-27 10:10:49

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力特 - LITTELFUSE		/
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02150.16MXESPP 数据手册

Introduction to Circuit Protection

Axial Lead Fuses

Transientology

5×20 mm > Time-Lag (Slo-Blo ) > 215SP Series

Temperature Rerating Curve

AverageTime Current Curves

10000

1000

100

0.1

0.01

0.001

0.01

0.1

100

Amps

Soldering Parameters -Wave Soldering

300

280

260

240

220

200

180

160

140

120

100

Recommended Process Parameters:

Wave Parameter

Preheat:

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Temperature Minimum:

Temperature Maximum:

PreheatTime:

Lead-Free Recommendation

(Typical Industry Recommendation)

100° C

150° C

60-180 seconds

Solder PotTemperature:

Solder DwellTime:

260° C Maximum

2-5 seconds

Recommended Hand-Solder Parameters:

Time (Seconds)

Preheat Time

Dwell Time

Cooling Time

Solder IronTemperature: 350° C +/- 5°C

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Note: These devices are not recommended for IR or

Convection Reﬂow process.

215SP Series

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com/series/215SP.html for current information.

123 4

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