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ZL70002/UDJ

更新时间: 2024-02-24 23:45:06
品牌 Logo 应用领域
美高森美 - MICROSEMI 电信电信集成电路
页数 文件大小 规格书
12页 269K
描述
Surge Protection Circuit, DIE-7

ZL70002/UDJ 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIE包装说明:DIE,
针数:7Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.88
JESD-30 代码:R-XUUC-N7JESD-609代码:e0
功能数量:1端子数量:7
最高工作温度:55 °C最低工作温度:
封装主体材料:UNSPECIFIED封装代码:DIE
封装形状:RECTANGULAR封装形式:UNCASED CHIP
认证状态:Not Qualified表面贴装:YES
电信集成电路类型:SURGE PROTECTION CIRCUIT温度等级:COMMERCIAL
端子面层:TIN LEAD端子形式:NO LEAD
端子位置:UPPERBase Number Matches:1

ZL70002/UDJ 数据手册

 浏览型号ZL70002/UDJ的Datasheet PDF文件第2页浏览型号ZL70002/UDJ的Datasheet PDF文件第3页浏览型号ZL70002/UDJ的Datasheet PDF文件第4页浏览型号ZL70002/UDJ的Datasheet PDF文件第5页浏览型号ZL70002/UDJ的Datasheet PDF文件第6页浏览型号ZL70002/UDJ的Datasheet PDF文件第7页 
ZL70002/08/09/10  
Medical Surge Protection Devices  
Data Sheet  
July 2003  
Features  
Extremely fast turn-on  
Ordering Information  
Very small size and very low leakage  
5, 6 and 7 terminals available  
ZL70002/UDJ Bumped Die, Waffle Tray  
ZL70008/UDJ Bumped Die, Waffle Tray  
ZL70009/UDJ Bumped Die, Waffle Tray  
ZL70010/UDJ Bumped Die, Waffle Tray  
0 to +55°C  
Standard delivery form: solder bumped die  
Facilitates compliance with EN-45502 and EN-  
50061  
Description  
Superior Quality  
The ZL70002/08/09/10 family are high performance  
surge protection devices targeted for medical  
applications.  
QA procedures based on MIL-PRF-38535  
Traceability for every chip to lot and wafer  
number  
100% burn-in capability  
Applications  
Pacemakers, Implantable Cardioverter  
Defibrillators (ICDs), Neurostimulators, Bladder  
Control Devices  
Medical devices with electronics requiring  
protection against a high voltage surge  
Rb  
Rb  
Rb  
Rb  
Rb  
Rb  
T4  
T3  
T1  
T2  
T5  
T6  
Figure 1 - ZL70010 Block Diagram  
1
Zarlink Semiconductor Inc.  

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