Z0107MN0
NXP Semiconductors
4Q Triac
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDRM
Parameter
Conditions
Min
Max
600
1
Unit
V
repetitive peak off-state voltage
RMS on-state current
-
-
IT(RMS)
full sine wave; Tsp ≤ 103 °C; see Figure 3;
A
see Figure 1; see Figure 2
ITSM
non-repetitive peak on-state
current
full sine wave; Tj(init) = 25 °C; tp = 20 ms;
see Figure 4; see Figure 5
-
12.5
A
full sine wave; Tj(init) = 25 °C; tp = 16.7 ms
tp = 10 ms; sine-wave pulse
-
-
-
13.8
0.78
50
A
A2s
I2t
I2t for fusing
dIT/dt
rate of rise of on-state current
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs;
T2+ G+
A/µs
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs;
T2+ G-
-
-
-
50
50
20
A/µs
A/µs
A/µs
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs;
T2- G-
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs;
T2- G+
IGM
peak gate current
peak gate power
-
1
A
PGM
PG(AV)
Tstg
Tj
-
2
W
W
°C
°C
average gate power
storage temperature
junction temperature
over any 20 ms period
-
0.1
150
125
-40
-
003aac269
003aac270
8
1.2
IT(RMS)
(A)
IT(RMS)
(A)
6
0.8
0.4
0
4
2
0
10-2
10-1
1
10
-50
0
50
100
150
sp (°C)
T
surge duration (s)
Fig 1. RMS on-state current as a function of surge
duration; maximum values
Fig 2. RMS on-state current as a function of solder
point temperature; maximum values
Z0107MN0
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 01 — 3 January 2011
3 of 16