Z0103MN,135

更新时间： 2024-02-18 10:56:48

品牌	Logo	应用领域
恩智浦 - NXP		可控硅
页数	文件大小	规格书
12页	178K
描述
Logic level four-quadrant triac

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Z0103MN,135 数据手册

Z0103MN

NXP Semiconductors

Logic level four-quadrant triac

003aad391

1.2

I_T(RMS)

(A)

0.8

0.4

−50

100

150

_sp(°C)

Fig 4. Maximum permissible RMS on-state current as a function of solder point temperature; typical values.

5. Thermal characteristics

Table 5.

Symbol

R_th(j-sp)

Thermal characteristics

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from see Figure 5

junction to solder point

K/W

R_th(j-a)

thermal resistance from

junction to ambient

150

K/W

003aad390

10²

Z_th(j-sp)

(K/W)

10⁻¹

t_p

10⁻²

10⁻⁵

10⁻¹

10⁻⁴

10⁻³

10⁻²

t_p(s)

Fig 5. Transient thermal impedance from junction to solder point as a function of pulse duration

Z0103MN_3

Product data sheet

Rev. 03 — 5 August 2009

5 of 12

1 2 3 456 7 8...12

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