TPS61299
www.ti.com.cn
ZHCSPX6A –MARCH 2023 –REVISED JUNE 2023
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
-0.7
MAX
6.5
8
UNIT
V
VIN, VOUT, SW, EN, VSEL
Voltage
SW spike at 10 ns
V
SW spike at 1 ns
-0.7
10
V
TJ
Operating Junction Temperature
Storage temperature
125
150
°C
°C
–40
–65
Tstg
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001, all pins(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC
specificationJESD22-C101, all pins(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. [Following
sentence optional; see the wiki.] Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. [Following
sentence optional; see the wiki.] Manufacturing with less than 250-V CDM is possible with the necessary precautions.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
0.5
NOM
MAX
5.5
UNIT
V
VIN
VOUT
TJ
Input voltage
Boost output voltage
1.8
5.5
V
Junction temperature
125
°C
µH
µF
µF
–40
0.47*0.7
5*0.8
2.2
L
Effective Inductance
1.0
10
1.0*1.3
COUT
CIN
Effective Output Capacitance at the OUT pin
Effective Input Capacitance at the VIN pin
6.4 Thermal Information
TPS61299
YFF 6-BALLS
Standard
TPS61299
YFF 6-BALLS
EVM
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
130.0
0.9
107.1
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
N/A
N/A
4.1
39.4
0.2
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ΨJT
39.4
N/A
62.7
N/A
ΨJB
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SLVSGS9
4
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