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XTPS560430X3FDBVR

更新时间： 2023-09-03 20:27:34
品牌 Logo 应用领域
德州仪器 - TI 稳压器
页数 文件大小 规格书
33页 1332K
描述
具有高效睡眠模式的 SIMPLE SWITCHER® 36V 600mA 降压稳压器 | DBV | 6

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XTPS560430X3FDBVR 数据手册

 浏览型号XTPS560430X3FDBVR的Datasheet PDF文件第1页浏览型号XTPS560430X3FDBVR的Datasheet PDF文件第2页浏览型号XTPS560430X3FDBVR的Datasheet PDF文件第3页浏览型号XTPS560430X3FDBVR的Datasheet PDF文件第5页浏览型号XTPS560430X3FDBVR的Datasheet PDF文件第6页浏览型号XTPS560430X3FDBVR的Datasheet PDF文件第7页 
TPS560430  
ZHCSI48B –SEPTEMBER 2017–REVISED JUNE 2018  
www.ti.com.cn  
7 Specifications  
7.1 Absolute Maximum Ratings  
Over the recommended operating junction temperature range of -40 °C to 125 °C (unless otherwise noted)  
(1)  
PARAMETER  
VIN to GND  
MIN  
–0.3  
–0.3  
–0.3  
–0.3  
–3.5  
–0.3  
–40  
MAX  
38  
UNIT  
Input Voltages  
EN to GND  
FB to GND  
SW to GND  
VIN + 0.3  
5.5  
V
VIN + 0.3  
38  
Output Voltages SW to GND less than 10 ns transient  
V
CB to SW  
5.5  
(2)  
TJ  
Junction temperature  
Storage temperature  
150  
°C  
Tstg  
–65  
150  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) Operating at junction temperatures greater than 125°C, although possible, degrades the lifetime of the device.  
7.2 ESD Ratings  
VALUE  
± 2500  
± 750  
UNIT  
V
(1)  
Human-body model (HBM)  
Charged-device model (CDM)  
VESD  
Electrostatic discharge  
(2)  
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
7.3 Recommended Operating Conditions  
Over the recommended operating junction temperature range of -40 °C to 125 °C (unless otherwise noted)  
(1)  
PARAMETER  
MIN  
4
MAX  
36  
UNIT  
VIN to GND  
Input Voltages  
EN  
0
VIN  
4.5  
V
FB  
0
Output Voltage  
Output Current  
Temperature  
VOUT  
1.0  
0
95% of VIN  
600  
V
IOUT  
mA  
°C  
Operating junction temperature range, TJ  
–40  
+125  
(1) Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but do not guarantee specific  
performance limits. For guaranteed specifications, see Electrical Characteristics  
7.4 Thermal Information  
(1)  
THERMAL METRIC  
DBV (6 PINS)  
UNIT  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
(2)  
RθJA  
Junction-to-ambient thermal resistance  
Junction-to-case (TOP) thermal resistance  
Junction-to-case (BOTTOM) thermal resistance  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
173  
116  
31  
RθJC_T  
RθJC_B  
ψJT  
20  
ψJB  
30  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report, SPRA953  
(2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These  
values were calculated in accordance with JESD 51-7, and simulated on a specified JEDEC board. They do not represent the  
performance obtained in an actual application.  
4
Copyright © 2017–2018, Texas Instruments Incorporated  
 
 
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