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XPC7455RX733LC PDF预览

XPC7455RX733LC

更新时间: 2024-01-27 10:25:52
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 时钟外围集成电路
页数 文件大小 规格书
60页 441K
描述
RISC Microprocessor, 32-Bit, 733MHz, CMOS, CBGA483, 29 X 29 MM, 3.22 M HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-483

XPC7455RX733LC 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:BGA, BGA483,22X22,50Reach Compliance Code:unknown
ECCN代码:3A001.A.3HTS代码:8542.31.00.01
风险等级:8.67地址总线宽度:36
位大小:32边界扫描:YES
最大时钟频率:133 MHz外部数据总线宽度:64
格式:FLOATING POINT集成缓存:YES
JESD-30 代码:S-CBGA-B483JESD-609代码:e0
长度:29 mm低功率模式:YES
端子数量:483封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:BGA封装等效代码:BGA483,22X22,50
封装形状:SQUARE封装形式:GRID ARRAY
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.3,1.5/2.5,1.8/2.5 V
认证状态:Not Qualified座面最大高度:3.22 mm
速度:733 MHz子类别:Microprocessors
最大供电电压:1.65 V最小供电电压:1.55 V
标称供电电压:1.6 V表面贴装:YES
技术:CMOS端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:29 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

XPC7455RX733LC 数据手册

 浏览型号XPC7455RX733LC的Datasheet PDF文件第2页浏览型号XPC7455RX733LC的Datasheet PDF文件第3页浏览型号XPC7455RX733LC的Datasheet PDF文件第4页浏览型号XPC7455RX733LC的Datasheet PDF文件第5页浏览型号XPC7455RX733LC的Datasheet PDF文件第6页浏览型号XPC7455RX733LC的Datasheet PDF文件第7页 
Advance Information  
MPC7455EC/D  
Rev.0, 2/2002  
MPC7455 RISC  
Microprocessor  
Hardware SpeciÞcations  
This document is primarily concerned with the MPC7455. However, unless otherwise noted,  
all information here also applies to the MPC7445. The MPC7455 and MPC7445 are reduced  
instruction set computing (RISC) microprocessors that implement the PowerPC instruction  
set architecture. This document describes pertinent electrical and physical characteristics of  
the MPC7455. For functional characteristics of the processor, refer to the MPC7450 RISC  
Microprocessor Family User’s Manual.  
This document contains the following topics:  
Topic  
Page  
Section 1.1, “Overview”  
Section 1.2, “Features”  
2
4
Section 1.3, “Comparison with the MPC7400, MPC7410, MPC7450, MPC7451, and  
MPC7441”  
8
Section 1.4, “General Parameters”  
Section 1.5, “Electrical and Thermal Characteristics”  
Section 1.6, “Pin Assignments”  
10  
11  
32  
34  
40  
43  
55  
55  
Section 1.7, “Pinout Listings”  
Section 1.8, “Package Description”  
Section 1.9, “System Design Information”  
Section 1.10, “Document Revision History”  
Section 1.11, “Ordering Information”  
To locate any published updates for this document, refer to the website at  
http://www.motorola.com/semiconductors.  
 

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