Material Content Data Sheet
Sales Product Name XMC1301-T038F0032 AB
Issued
14. September 2015
MA#
MA001408470
Package
PG-TSSOP-38-9
Weight*
118.39 mg
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
[%]
Sum
Construction Element
Material Group
Substances
Mass
[ppm]
if applicable
[ppm]
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
silicon
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-05-3
7440-50-8
1333-86-4
-
1.226
0.015
0.060
1.199
48.679
0.003
0.311
0.192
7.479
56.249
2.200
0.337
0.111
0.332
1.04
0.01
0.05
1.01
41.12
0.00
0.26
0.16
6.32
47.52
1.86
0.28
0.09
0.28
1.04
10353
127
10353
leadframe
phosphorus
zinc
506
iron
10126
411170
27
copper
42.19
0.26
421929
2656
wire
palladium
copper
non noble metal
organic material
plastics
2629
1620
63167
475102
18580
2849
936
encapsulation
carbon black
epoxy resin
silicondioxide
tin
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
-
54.00
1.86
0.28
539889
18580
2849
leadfinish
plating
glue
silver
plastics
epoxy resin
silver
noble metal
7440-22-4
0.37
2808
3744
*deviation
< 10%
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com