Datasheet > XBCR00839202B

XBCR00839202B

更新时间： 2023-02-26 14:09:19

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
3页	98K
描述
Fixed Resistor, Thin Film, 0.25W, 392000ohm, 75V, 0.1% +/-Tol, 250ppm/Cel, Surface Mount, 0202, CHIP

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XBCR00839202B 数据手册

BCR

Vishay Electro-Films

Thin Film, Back-Contact Resistor

FEATURES

• Wire bondable

Product may not

be to scale

• Only one wire bond required

• Small size: 0.020 inches square.

• Resistance range: 10 Ω to 1 MΩ

• Oxidized silicon substrate for good power dissipation

• Resistor material: Tantalum nitride, self-passivating

• Moisture resistant

The Back Contact Resistor (BCR) series single-value

back-contact resistor chip is one of the smallest chips available.

The BCR requires only one wire bond thus saving hybrid space.

The BCRs are manufactured using Vishay Electro-Films

(EFI) sophisticated thin film equipment and manufacturing

technology. The BCRs are 100 % electrically tested and

visually inspected to MIL-STD-883.

APPLICATIONS

Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by

attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the

notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting

the resistor to the bottom of the chip.)

TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES

Tightest Standard Tolerance Available

PROCESS CODE

2 % ꢀ %

1 % 0.2 % 0.ꢀ %

0.1 %

CLASS H*

CLASS K*

056

ꢀ2 ꢁꢁmꢂ/C

010

20 ꢁꢁmꢂ/C

002

061

100 ꢁꢁmꢂ/C

027

059

ꢀ20 ꢁꢁmꢂ/C

008

052

*MIL-PRF-38534 inspection criteria

360 kΩ

1 MΩ

6ꢀ0 kΩ

ꢀ00 kΩ

10 Ω ꢀ0 Ω 20 Ω 100 Ω ꢀ00 Ω 1 kΩ

STANDARD ELECTRICAL SPECIFICATIONS

PARAMETER

Noise, MIL-STD-ꢀ0ꢀ, Method 308

100 Ω - ꢀ20 kΩ

< 100 Ω or > ꢀ21 kΩ

- 35 dB typ.

- 20 dB typ.

Moisture resistance, MIL-STD-ꢀ0ꢀ

Method 106

0.5 % max. ΔR/R

Stability, 1000 h, + 1ꢀ2 /C, 1ꢀ2 mW

1.0 % max. ΔR/R

Oꢁerating Temꢁerature Range

- 55 °C to + 125 °C

Thermal Shock, MIL-STD-ꢀ0ꢀ,

Method 107, Test Condition F

0.25 % max. ΔR/R

High Temꢁerature Exꢁosure, + 120 /C, 100 h

Dielectric Voltage Breakdown

0.5 % max. ΔR/R

200 V

Insulation Resistance

10¹²min.

Oꢁerating Voltage

75 V max.

DC Power Rating at + 70 /C (Derated to Zero at + 172 /C)

2 x Rated Power Short-Time Overload, + ꢀ2 /C, 2 s

250 mW

0.25 % max. ΔR/R

www.vishay.com

For technical questions, contact: efi@vishay.com

Document Number: 61023

Revision: 12-Mar-08

12 3

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