Datasheet > X4163S8I-2.7A

X4163S8I-2.7A

更新时间： 2024-01-02 08:38:41

品牌	Logo	应用领域
瑞萨 - RENESAS		光电二极管
页数	文件大小	规格书
22页	924K
描述
1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO8, PLASTIC, SOIC-8

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X4163S8I-2.7A 技术参数

是否Rohs认证：	不符合	生命周期：	Transferred
包装说明：	PLASTIC, SOIC-8	Reach Compliance Code：	unknown
风险等级：	5.76	Is Samacsys：	N
可调阈值：	YES	模拟集成电路 - 其他类型：	POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 代码：	R-PDSO-G8	JESD-609代码：	e0
长度：	4.89 mm	信道数量：	1
功能数量：	1	端子数量：	8
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	SOP
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE
认证状态：	Not Qualified	座面最大高度：	1.75 mm
最大供电电压 (Vsup)：	5.5 V	最小供电电压 (Vsup)：	2.7 V
标称供电电压 (Vsup)：	5 V	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子面层：	Tin/Lead (Sn/Pb)	端子形式：	GULL WING
端子节距：	1.27 mm	端子位置：	DUAL
宽度：	3.9 mm	Base Number Matches：	1

X4163S8I-2.7A 数据手册

X4163, X4165

Thin Shrink Small Outline Plastic Packages (TSSOP)

M8.173

8 LEAD THIN SHRINK NARROW BODY SMALL OUTLINE

PLASTIC PACKAGE

INDEX

AREA

0.25(0.010)

B M

-B-

INCHES

MIN

MILLIMETERS

GAUGE

PLANE

SYMBOL

MAX

0.047

0.006

0.051

0.0118

0.0079

0.120

0.177

MIN

MAX

1.20

0.15

1.05

0.30

0.20

3.05

4.50

NOTES

0.002

0.031

0.0075

0.0035

0.116

0.169

0.05

0.80

0.19

0.09

2.95

4.30

0.25

0.010

0.05(0.002)

SEATING PLANE

-A-

-C-



0.026 BSC

0.65 BSC

0.10(0.004)

0.246

0.256

6.25

0.45

6.50

0.75

0.10(0.004) M

A M B S

0.0177

0.0295

NOTES:

0^o

8^o

0^o

8^o



1. These package dimensions are within allowable dimensions of

JEDEC MO-153-AC, Issue E.

Rev. 1 12/00

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm

(0.006 inch) per side.

4. Dimension “E1” does not include interlead flash or protrusions. Inter-

lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per

side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “b” does not include dambar protrusion. Allowable dambar

protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-

sion at maximum material condition. Minimum space between protru-

sion and adjacent lead is 0.07mm (0.0027 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact. (Angles in degrees)

All trademarks and registered trademarks are the property of their respective owners.

For additional products, see www.intersil.com/en/products.html

Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted

in the quality certifications found at www.intersil.com/en/support/qualandreliability.html

Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such

modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are

current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its

subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or

otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN8120 Rev 2.00

November 26, 2007

Page 22 of 22

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