是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | SOIC | 包装说明: | SOP, SOP8,.25 |
针数: | 8 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 5.92 | 最大时钟频率 (fCLK): | 5 MHz |
数据保留时间-最小值: | 100 | 耐久性: | 100000 Write/Erase Cycles |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e0 |
长度: | 4.89 mm | 内存密度: | 32768 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
湿度敏感等级: | 3 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 4096 words |
字数代码: | 4000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 4KX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装等效代码: | SOP8,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.75 mm | 串行总线类型: | SPI |
最大待机电流: | 0.000001 A | 子类别: | EEPROMs |
最大压摆率: | 0.005 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3.9 mm | 最长写入周期时间 (tWC): | 10 ms |
写保护: | HARDWARE/SOFTWARE |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
X25330S8-2.5 | ICMIC |
获取价格 |
5MHz SPI Serial E2 PROM with Block Lock Protection | |
X25330S8-2.5 | XICOR |
获取价格 |
5MHz SPI Serial E 2 PROM with Block Lock TM Protection | |
X25330S8G | ICMIC |
获取价格 |
5MHz SPI Serial E2 PROM with Block Lock Protection | |
X25330S8G-2.5 | ICMIC |
获取价格 |
5MHz SPI Serial E2 PROM with Block Lock Protection | |
X25330S8I | XICOR |
获取价格 |
5MHz SPI Serial E 2 PROM with Block Lock TM Protection | |
X25330S8I | ICMIC |
获取价格 |
5MHz SPI Serial E2 PROM with Block Lock Protection | |
X25330S8I-2.5 | XICOR |
获取价格 |
5MHz SPI Serial E 2 PROM with Block Lock TM Protection | |
X25330S8I-2.5 | ICMIC |
获取价格 |
5MHz SPI Serial E2 PROM with Block Lock Protection | |
X25330S8I-2.5T1 | XICOR |
获取价格 |
EEPROM, 4KX8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | |
X25330S8I-2.5T3 | XICOR |
获取价格 |
EEPROM, 4KX8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 |