是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | DIP |
包装说明: | DIP, DIP8,.3 | 针数: | 8 |
Reach Compliance Code: | unknown | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.88 |
最大时钟频率 (fCLK): | 2 MHz | 数据保留时间-最小值: | 100 |
耐久性: | 100000 Write/Erase Cycles | JESD-30 代码: | R-PDIP-T8 |
JESD-609代码: | e0 | 长度: | 10.03 mm |
内存密度: | 16384 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 8 | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 2048 words | 字数代码: | 2000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 2KX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | DIP |
封装等效代码: | DIP8,.3 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 3/5 V |
认证状态: | Not Qualified | 座面最大高度: | 4.32 mm |
串行总线类型: | SPI | 最大待机电流: | 0.000001 A |
子类别: | EEPROMs | 最大压摆率: | 0.005 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.7 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 7.62 mm |
最长写入周期时间 (tWC): | 10 ms | 写保护: | HARDWARE/SOFTWARE |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
X25160PMG | ICMIC |
获取价格 |
SPI Serial E2PROM With Block LockTM Protection | |
X25160PMG-2.7 | ICMIC |
获取价格 |
SPI Serial E2PROM With Block LockTM Protection | |
X25160S | ICMIC |
获取价格 |
SPI Serial E2PROM With Block LockTM Protection | |
X25160S | XICOR |
获取价格 |
SPI Serial E2PROM With Block LockTM Protection | |
X25160S-2.7 | XICOR |
获取价格 |
SPI Serial E2PROM With Block LockTM Protection | |
X25160S-2.7 | ICMIC |
获取价格 |
SPI Serial E2PROM With Block LockTM Protection | |
X25160S-2.7T1 | XICOR |
获取价格 |
EEPROM, 2KX8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | |
X25160S-2.7T4 | XICOR |
获取价格 |
EEPROM, 2KX8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | |
X25160S8 | XICOR |
获取价格 |
EEPROM, 2KX8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | |
X25160S8M | XICOR |
获取价格 |
EEPROM, 2KX8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 |