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X24C01SIG-3 PDF预览

X24C01SIG-3

更新时间: 2024-02-04 06:32:07
品牌 Logo 应用领域
ICMIC 内存集成电路光电二极管可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟
页数 文件大小 规格书
14页 275K
描述
Serial E2PROM

X24C01SIG-3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP,针数:8
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.78
Is Samacsys:N最大时钟频率 (fCLK):0.1 MHz
JESD-30 代码:R-PDSO-G8长度:4.89 mm
内存密度:1024 bit内存集成电路类型:EEPROM
内存宽度:8功能数量:1
端子数量:8字数:128 words
字数代码:128工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128X8封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE并行/串行:SERIAL
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:1.75 mm串行总线类型:I2C
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.9 mm最长写入周期时间 (tWC):10 ms
Base Number Matches:1

X24C01SIG-3 数据手册

 浏览型号X24C01SIG-3的Datasheet PDF文件第8页浏览型号X24C01SIG-3的Datasheet PDF文件第9页浏览型号X24C01SIG-3的Datasheet PDF文件第10页浏览型号X24C01SIG-3的Datasheet PDF文件第11页浏览型号X24C01SIG-3的Datasheet PDF文件第12页浏览型号X24C01SIG-3的Datasheet PDF文件第13页 
X24C01  
ORDERING INFORMATION  
VCC Limits  
X24C01  
P
T
G -V  
Blank = 4.5V to 5.5V  
3.5 = 3.5V to 5.5V  
3 = 3.0V to 5.5V  
Device  
2.7 = 2.7V to 5.5V  
G=RoHS Compliant Lead Free package  
Blank = Standard package. Non lead free  
Temperature Range  
Blank = Commercial = 0°C to +70°C  
I = Industrial = –40°C to +85°C  
M = Military = –55°C to +125°C  
Package  
P = 8-Lead Plastic DIP  
S = 8-Lead SOIC  
M = 8-Lead MSOP  
Part Mark Convention  
X24C01 X G  
Blank = 8-Lead SOIC  
P = 8-Lead Plastic DIP  
M = 8-Lead MSOP  
G = RoHS compliant lead free  
X
Blank = 4.5V to 5.5V, 0°C to +70°C  
F = 2.7V to 5.5V, 0°C to +70°C  
G = 2.7V to 5.5V, –40°C to +85°C  
I = 4.5V to 5.5V, –40°C to +85°C  
B = 3.5V to 5.5V, 0°C to +70°C  
C = 3.5V to 5.5V, –40°C to +85°C  
D = 3.0V to 5.5V, 0°C to +70°C  
E = 3.0V to 5.5V, –40°C to +85°C  
M = 4.5V to 5.5V, –55°C to +125°C  
LIMITED WARRANTY  
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express,  
statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no  
warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without  
notice.  
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are implied.  
U.S. PATENTS  
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475; 4,450,402;  
4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and additional patents  
pending.  
LIFE RELATED POLICY  
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection  
and correction, redundancy and back-up features to prevent such an occurrence.  
Xicor's products are not authorized for use in critical components in life support devices or systems.  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose  
failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the  
user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
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