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WQPH252012M1R5PS PDF预览

WQPH252012M1R5PS

更新时间: 2024-04-09 18:58:14
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
8页 536K
描述
SMD Molded Power Choke (AEC-Q200) / WQPH Series 1.5, 30, 2.9A

WQPH252012M1R5PS 数据手册

 浏览型号WQPH252012M1R5PS的Datasheet PDF文件第2页浏览型号WQPH252012M1R5PS的Datasheet PDF文件第3页浏览型号WQPH252012M1R5PS的Datasheet PDF文件第4页浏览型号WQPH252012M1R5PS的Datasheet PDF文件第5页浏览型号WQPH252012M1R5PS的Datasheet PDF文件第6页浏览型号WQPH252012M1R5PS的Datasheet PDF文件第7页 
Reference IPC-020c-5-1  
Profile Feature  
Pb free Assembly  
Average Ramp Rate  
(Ts max to Tp)  
Preheat  
3 /second max  
-
-
-
Temperature Min (Tsmin  
Temperature Min (Tsmax  
Time(tsmin to tsmin  
)
150℃  
200℃  
60-180 seconds  
)
)
Time maintained above:  
-
-
Temperature (TL)  
Time (tL)  
217℃  
60-150 seconds  
Peak Temperature (Tp)  
260+0/-5 ℃  
Time within 5 of actual Peak  
Temperature (Tp)  
20-40 seconds  
6 /second max.  
Ramp-Down Rate  
Time 25to Peak Temperature  
8 minutes max  
Soldering gun procedure  
Note the follows, in case of using solder gun for replacement.  
(1) The tip temperature must be less than 280C for the period within 3 seconds by using soldering gun under  
30 W.  
(2)The soldering gun tip shall not touch this product directly.  
Soldering volume  
Note that excess of soldering volume will easily get crack the body of this product.  
Taping Package Storage Condition  
Storage Temperature : 5 to 40 ℃  
Relative Humidity: < 65%RH  
Storage Time : 12 months max.  
Page 8 of 8  
ASC_WQPH252012 Series  
May.2023  

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