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WL1271-TIWI_14 PDF预览

WL1271-TIWI_14

更新时间: 2024-01-15 13:53:02
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描述
WLAN 802.11 b/g/n and Bluetooth® v2.1 EDR Module

WL1271-TIWI_14 数据手册

 浏览型号WL1271-TIWI_14的Datasheet PDF文件第2页 
WL1271-TiWi  
www.ti.com  
SWRS100A JANUARY 2011REVISED MARCH 2011  
WLAN 802.11 b/g/n and Bluetooth® v2.1 + EDR Module  
1
FEATURES  
APPLICATIONS  
Consumer Devices  
2345  
IEEE 802.11 b/g/n Compliant  
Typical WLAN Transmit power:  
Industrial and Home Automation  
Point of Sale and Point of Purchase  
Video Conferencing, Video Camera and VoIP  
Medical Devices  
+20dBm, 11Mbps, CCK (b)  
+14.5dBm, 54Mbps, OFDM (g)  
+12.5dBm, 65Mbps, OFDM (n)  
Security and Surveillance  
Typical WLAN Receiver sensitivity:  
89dBm, 8% PER, 11Mbps  
76dBm, 10% PER, 54Mbps  
73dBm, 10% PER, 65Mbps  
DESCRIPTION  
The following product brief applies to LS Researchs  
WLAN + Bluetooth module, series name: TiWi. The  
WLAN + Bluetooth chip used is the WL1271 from  
Texas Instruments.  
Bluetooth v2.1 + Enhanced Data Rate (EDR)  
Increased Bluetooth Transmit Power:  
+9.5dBm Typical  
The WL1271-TiWi is  
a
fully-integrated high  
-92dBm typical Bluetooth® Receiver Sensitivity  
performance module offered by LS Research using  
TIs single-chip WL1271 2.4GHz IEEE 802.11 b/g/n  
and Bluetooth v2.1 + Enhanced Data Rate (EDR)  
Transceiver. Based on TIs 6th generation WLAN  
technology and 7th generation Bluetooth technology,  
the solution provides best-in-class coexistence  
capabilities coupled with TIs Enhanced Low Power  
(ELP) technology. The WL1271-TiWi is provided as a  
module to help customers reduce development time,  
lower manufacturing costs, save board space, ease  
certification, and minimize RF expertise required. For  
evaluation and development, various platforms are  
available which integrate the WL1271-TiWi module,  
Linux WLAN drivers, BlueZ Bluetooth stack, and  
sample source applications running on a TI host  
processor (AM/DM37x, AM18x, OMAP4).  
Best-In-Class WLAN and Bluetooth  
Coexistence Technology on a Single-Chip  
Enhanced Low Power (ELP) Technology for  
Extended Battery Life  
On Board TCXO, Power Regulation and U.FL  
Antenna Connector  
Hardware and Software Pre-integration With  
TI's AM/DM37x (ARM Cortex-A8), AM18xx  
(ARM9), and OMAP4(ARM Cortex-A9)  
Platforms  
Software Upgradable for ANT and Bluetooth  
Low Energy  
Dimensions: 13mm x 18mm x 1.9mm  
FCC/IC/CE Certified  
The full specification and purchasing of the  
WL1271-TiWi module can be found on LSR's website  
(www.lsr.com/tiwi). More information on TIs wireless  
platform solutions can be found on the Wireless  
Connectivity Wiki (www.ti.com/connectivitywiki).  
Operating Temperature Range: 40°C to 85°C  
Disclaimer:  
All content in and linked to this product brief is provided by TI "AS IS" without express or implied warranties of  
any kind, and it may contain errors, omissions and technical inaccuracies. TI does not endorse or warrant any of  
the third party products or services referenced on this product brief. This information is provided subject to TIs  
Terms of Use.  
Be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
4
5
OMAP4 is a trademark of Texas Instruments.  
Cortex is a trademark of ARM.  
Bluetooth is a registered trademark of Bluetooth SIG, Inc.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2011, Texas Instruments Incorporated  

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