生命周期: | Transferred | 包装说明: | PGA TYPE, CERAMIC, HIP-66 |
Reach Compliance Code: | unknown | 风险等级: | 5.84 |
最长访问时间: | 120 ns | JESD-30 代码: | S-CHIP-P66 |
内存密度: | 4194304 bit | 内存集成电路类型: | FLASH MODULE |
内存宽度: | 32 | 功能数量: | 1 |
端子数量: | 66 | 字数: | 131072 words |
字数代码: | 128000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 128KX32 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装形状: | SQUARE | 封装形式: | IN-LINE |
并行/串行: | PARALLEL | 编程电压: | 5 V |
认证状态: | Not Qualified | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | PIN/PEG |
端子位置: | HEX | 类型: | NOR TYPE |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WF128K32-120H1I5A | MERCURY |
获取价格 |
Flash Module, 128KX32, 120ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
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WF128K32-120H1I5A | WEDC |
获取价格 |
Flash Module, 128KX32, 120ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
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WF128K32-120H1M5 | MERCURY |
获取价格 |
Flash Module, 128KX32, 120ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
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WF128K32-120H1M5 | WEDC |
获取价格 |
Flash Module, 128KX32, 120ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
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WF128K32-120H1M5A | WEDC |
获取价格 |
Flash Module, 128KX32, 120ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
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WF128K32-120H1M5A | MERCURY |
获取价格 |
Flash Module, 128KX32, 120ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
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WF128K32-120H1Q5 | WEDC |
获取价格 |
Flash Module, 128KX32, 120ns, CPGA66, HIP-66 |
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WF128K32-120H1Q5A | WEDC |
获取价格 |
Flash Module, 128KX32, 120ns, CPGA66, |
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WF128K32-120HI | WEDC |
获取价格 |
Flash Module, 512KX8, 120ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
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WF128K32-120HM5A | WEDC |
获取价格 |
Flash Module, 512KX8, 120ns, CHIP66, |
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