WEDF1M32B-XXX5
White Electronic Designs
ADVANCED*
1Mx32 5V Flash Module
FEATURES
ꢀ
Access Times of 70, 90, 120ns
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ꢀ
Organized as 1Mx32, user configurable as 2Mx16
or 4Mx8.
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Packaging:
Commercial, Industrial and Military Temperature
Ranges
• 66 pin, PGA Type, 1.185” square, Hermetic
Ceramic HIP (Package 401)
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ꢀ
ꢀ
ꢀ
5V 10ꢀ for Read and Write Operations.
Low Power CMOS
• 68 lead, 22mm Low Profile CQFP, 4.6mm
(0.180”), (Package 509)
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ꢀ
Sector Architecture
Embedded Erase and Program Algorithm
• One 16KByte Sectors
• Two 8KByte Sectors
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
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Weight
• One 32KByte Sectors
• Fifteen 64KByte Sectors
1,000,000 Erase/Program Cycles
WEDF1M32B-XG2TX5 - 8 grams typical
WEDF1M32B-XHX5 - 13 grams typical
* This product is under development, is not qualified or characterized and is subject to
change or cancellation without notice.
PIN CONFIGURATION FOR WF1M32B-XHX5
Top View
PIN DESCRIPTION
I/O0-31
A0-19
WE#
Data Inputs/Outputs
Address Inputs
Write Enable
1
12
23
34
45
56
I/O
I/O
8
RESET#
CS
I/O15
I/O14
I/O13
I/O12
OE#
I/O24
I/O25
I/O26
V
CC
I/O31
I/O30
I/O29
I/O28
CS1-4#
OE#
Chip Selects
9
2
#
CS4#
Output Enable
I/O10
GND
I/O11
NC
RESET# Reset
VCC
GND
NC
Power Supply
A
A
A
A
A
14
16
11
0
A7
I/O27
Ground
A
A
A
V
10
A
12
NC
13
A
A
A
4
5
6
A1
A2
A3
Not Connected
9
A17
15
CC
WE#
A
Block Diagram
18
I/O
I/O
I/O
I/O
7
6
5
4
A
8
I/O16
I/O17
I/O18
NC
CS
I/O23
I/O22
I/O21
I/O20
CS1#
CS2#
CS3#
CS4#
RESET#
WE#
I/O
I/O
I/O
0
1
2
CS1
#
3#
OE#
A0-19
A19
GND
I/O19
1M x 8
1M x 8
1M x 8
1M x 8
I/O
3
11
22
33
44
55
66
8
8
8
8
I/O16-23
I/O24-31
I/O0-7
I/O8-15
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
May 1999
Rev.1
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com