Datasheet > W83637HG

W83637HG

更新时间： 2024-02-29 15:42:10

品牌	Logo	应用领域
华邦 - WINBOND		PC
页数	文件大小	规格书
151页	1069K
描述
LPC I/O

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技术参数
数据手册

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W83637HG 技术参数

是否Rohs认证：	符合	生命周期：	Transferred
包装说明：	QFP, QFP128,.67X.93,20	Reach Compliance Code：	unknown
风险等级：	5.65	JESD-30 代码：	R-PQFP-G128
端子数量：	128	最高工作温度：	70 °C
最低工作温度：		封装主体材料：	PLASTIC/EPOXY
封装代码：	QFP	封装等效代码：	QFP128,.67X.93,20
封装形状：	RECTANGULAR	封装形式：	FLATPACK
电源：	5 V	认证状态：	Not Qualified
子类别：	Other Microprocessor ICs	标称供电电压：	5 V
表面贴装：	YES	温度等级：	COMMERCIAL
端子形式：	GULL WING	端子节距：	0.5 mm
端子位置：	QUAD	Base Number Matches：	1

W83637HG 数据手册

W83637HF/HG

Revision History

PAGES

DATES

VERSION

MAIN CONTENTS

No Released.

For Winbond Internal use only.

N. A.

03/25/2001

08/09/2001

02/18/2002

08/28/2002

09/27/2002

0.50

0.60

0.70

1.0

First published.

Update Chapter 10. (Hardware Monitor Device)

New update

1.1

ADD Secure Digital Function Description

ADD Block Digram

04/15/2003

1.2

100~101

ADD Chapter 4.1 Plug and Play Configuration

130~137

N.A.

06/25/2003

11/23/2005

02/10/2006

03/23/2006

1.3

1.4

1.5

1.6

Add Chapter 9 DC Specification

Add Pb-free package

N.A.

Remove 5VSB H/W monitor sensor function.

Correct GPIO pins to 21-pin, not 40-pin

Page.5

Please note that all data and specifications are subject to change without notice. All the trademarks of

products and companies mentioned in this data sheet belong to their respective owners.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where

malfunction of these products can reasonably be expected to result in personal injury. Winbond

customers using or selling these products for use in such applications do so at their own risk and

agree to fully indemnify Winbond for any damages resulting from such improper use or sales.

Publication Release Date: March, 2006

- I -

Revision 1.6

123 4 5 6 7...151

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