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VSC8502XML-03 PDF预览

VSC8502XML-03

更新时间: 2024-01-01 04:42:04
品牌 Logo 应用领域
美高森美 - MICROSEMI 电信电信集成电路
页数 文件大小 规格书
2页 233K
描述
Telecom Circuit, 1-Func, 12 X 12 MM, LEAD FREE, QFN-135

VSC8502XML-03 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:12 X 12 MM, LEAD FREE, QFN-135Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.66
JESD-30 代码:S-XQCC-N135功能数量:1
端子数量:135最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:QCCN封装形状:SQUARE
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
表面贴装:YES电信集成电路类型:TELECOM CIRCUIT
温度等级:AUTOMOTIVE端子形式:NO LEAD
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

VSC8502XML-03 数据手册

 浏览型号VSC8502XML-03的Datasheet PDF文件第2页 
VSC8502  
Dual Port GbE Copper PHY with Synchronous Ethernet and RGMII/GMII Interface  
Low-power PHY supports IEEE 802.3az Energy Efficient Ethernet.  
Highlights  
• EcoEthernet™ 2.0, the gold standard for  
Energy Efficient Ethernet (EEE)  
The VSC8502 device is designed for space-constrained  
10/100/1000BASE-T applications. It features integrated line-side  
termination to conserve board space, to lower EMI, and to improve  
system performance. To further reduce system complexity, component  
count, and system cost, the VSC8502 device can operate from a  
single 3.3 V supply using integrated voltage regulators that provide the  
necessary 1.0 V and 2.5 V rails for operation. Additionally, integrated  
RGMII timing compensation eliminates the need for on-board delay  
lines.  
• Wake-on-LAN (WOL)  
• Fast link failure indication  
• Synchronous Ethernet support  
• Dual recovered clocks for timing reference  
• Ring Resiliency™  
• Integrated voltage regulator  
• Pin compatible with VSC8501  
The VSC8502 device includes Microsemis EcoEthernet™ 2.0  
technology that supports Energy Efficient Ethernet and power saving  
features to reduce power based on link state and cable reach. The  
device optimizes power consumption in all link operating speeds and  
features Wake-on-LAN (WOL) power management using magic packets.  
Applications  
• IoT applications such as digital signage,  
eHealth, and industrial grade switches  
• Consumer electronics such as CPE,  
UHDTV, media servers, and NAS  
The VSC8502 device also includes fast link failure indication for high-  
availability networks. Fast link failure indication identifies the onset of  
a link failure in less than 1 ms typical to go beyond the IEEE 802.3  
standard requirement of 750 ms 10 ms (link master).  
• Wireless backhaul  
• Small cells, femtocells  
Synchronous Ethernet and Ring Resiliency™ are supported. The device  
has two recovered clock outputs for Synchronous Ethernet applications.  
Programmable clock squelch control is included to inhibit undesirable  
clocks from propagating and to help prevent timing loops. Ring  
Resiliency allows a PHY port to switch between master and slave timing  
references with no link drop in 1000BASE-T mode.  
3.3 V  
10/100/1000BASE-T MAC,  
Switching ASIC,  
or Network Processor  
VSC8502  
Dual Port  
PHY  
RGMII/GMII  
RJ45+Magnetics  
25 MHz  
Management I/F (MDC / MDIO)  
Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability  
whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction  
with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone  
and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyers responsibility to independently determine suitability  
of any products and to test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer.  
Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in  
this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice.  

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