VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datas heet
Mutli-Gigabit Interconnect Chip
VSC7217
Ordering Information
The part number for this product is formed by a combination of the device number and the package style:
xx
VSC7217
Device Type
Multi-Gigabit Interconnect Chip
Package
UC: 256-Pin, 27mm BGA
Marking Information
The package is marked with three lines of text as shown:
Pin 1 Identifier
VSC7217UC
Part Number
Package Suffix
####AAAA
Date Code
Lot Tracking Code
VITESSE
Notice
This document contains information about a new product during its fabrication or sampling phase of devel-
opment. The information in this document is based on design targets, simulation results or early prototype test
results. Characteristic data and other specifications are subject to change without notice. Therefore the reader is
cautioned to confirm that this data sheet is current prior to design or order placement.
Warning
Vitesse Semiconductor Corporation’s products are not intended for use in life support appliances, devices
or systems. Use of a Vitesse product in such applications without the written consent is prohibited.
Page 36
Ó VITESSE SEMICONDUCTOR CORPORATION
G52325-0, Rev. 3.0
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
6/14/00