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VSC7217 PDF预览

VSC7217

更新时间: 2022-09-12 00:09:29
品牌 Logo 应用领域
VITESSE /
页数 文件大小 规格书
36页 503K
描述
Multi-Gigabit Interconnect Chip

VSC7217 数据手册

 浏览型号VSC7217的Datasheet PDF文件第30页浏览型号VSC7217的Datasheet PDF文件第31页浏览型号VSC7217的Datasheet PDF文件第32页浏览型号VSC7217的Datasheet PDF文件第33页浏览型号VSC7217的Datasheet PDF文件第34页浏览型号VSC7217的Datasheet PDF文件第35页 
VITESSE  
SEMICONDUCTOR CORPORATION  
Preliminary Datas heet  
Mutli-Gigabit Interconnect Chip  
VSC7217  
Ordering Information  
The part number for this product is formed by a combination of the device number and the package style:  
xx  
VSC7217  
Device Type  
Multi-Gigabit Interconnect Chip  
Package  
UC: 256-Pin, 27mm BGA  
Marking Information  
The package is marked with three lines of text as shown:  
Pin 1 Identifier  
VSC7217UC  
Part Number  
Package Suffix  
####AAAA  
Date Code  
Lot Tracking Code  
VITESSE  
Notice  
This document contains information about a new product during its fabrication or sampling phase of devel-  
opment. The information in this document is based on design targets, simulation results or early prototype test  
results. Characteristic data and other specifications are subject to change without notice. Therefore the reader is  
cautioned to confirm that this data sheet is current prior to design or order placement.  
Warning  
Vitesse Semiconductor Corporation’s products are not intended for use in life support appliances, devices  
or systems. Use of a Vitesse product in such applications without the written consent is prohibited.  
Page 36  
Ó VITESSE SEMICONDUCTOR CORPORATION  
G52325-0, Rev. 3.0  
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896  
6/14/00  

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