VJ OMD Series
www.vishay.com
Vishay Vitramon
BOARDFLEX SENSITIVE APPLICATIONS - SOLUTION
A predominant failure mode in multilayer ceramic chip capacitors is cracking caused by board flexure. Cracks can then create
a path for current to pass from one electrode through the dielectric to an opposing electrode or from the terminations at one
end of the MLCC through the dielectric to an opposing electrode. This may subsequently result in capacitance loss, leakage -
low Insulation Resistance (IR) - and / or more seriously, high current shorts. A short circuit condition in the surface mounted
capacitors can cause further failures of downstream components. Vishay’s Open Mode Design Capacitors (VJ OMD - Cap.
series) reduce the risk of these destructive conditions through MLCC designs that prevent board flexure cracks reaching the
opposing electrode.
VJ OMD - Cap. MLCCs reduce the risk of early field failures associated with board flex cracks. However, it is important to note
that even in the open mode designs the presence of flexure related cracks can cause capacitance loss leading to localized
stresses on the parts. eventually, depending on the application environment, including such factors and high voltage pulse
frequency and thermal cycling this may lead to internal breakdown of the component.
POLYMER TERMINATION
Polymer termination provides additional protection against board flexure damage by absorbing greater mechanical and thermal
stresses. Components can be packaged, transported, stored and handled the same standard terminated product. Wave and
reflow soldering of MLCC does not require modification to equipment and / or process. Polymer termination greatly reduces the
risk of mechanical cracking however it does not completely eliminate.
STANDARD TERMINATION
OMD CAP PLUS POLYMER TERMINATION
Exposed Electrodes = Electrical Short
No Exposed Electrodes = No Electrical Short
STANDARD PACKAGING QUANTITIES (1)(2)(3)
7" REEL QUANTITIES
11 1/4" AND 13" REEL QUANTITIES
CASE
CODE
TAPE
SIZE
PAPER TAPE PACKAGING
PLASTIC TAPE
PACKAGING CODE “T” PACKAGING CODE “P” / “I”
PAPER TAPE
PLASTIC TAPE
PACKAGING CODE “R”
CODE “C” / “O”
0805 (4)(5)
1206 (4)
1210 (4)
1808 (4)
1812 (4)
1825
8 mm
8 mm
8 mm
12 mm
12 mm
12 mm
12 mm
12 mm
3000
n/a
n/a
n/a
n/a
n/a
n/a
n/a
3000
2500 / 3000
2000 / 2500 / 3000
2000
10 000
n/a
n/a
n/a
n/a
n/a
n/a
n/a
10 000
9000 / 10 000
9000 / 10 000
10 000
1000
1000
1000
500
4000
4000
n/a
n/a
2220
2225
Notes
(1)
Vishay Vitramon uses embossed plastic, and punch paper carrier tapes. Paper tape is not available for case sizes ≥ 1206 or for component
thickness > 0.035" (0.89 mm)
(2)
(3)
(4)
(5)
Reference: EIA standard RS 481 - “Taping of Surface Mount Components for Automatic Placement”
n/a = not available
Packaging code “C” / “O”, “P / I” and lower quantities can depend from product thickness
Polymer termination, code “B”, only available in plastic tape “T” / “R”
STORAGE AND HANDLING CONDITIONS
(1) Store the components at 5 °C to 40 °C ambient temperature and ≤ 70 % relative humidity conditions.
(2) The product is recommended to be used within a time-frame of 2 years after shipment.
Check solderability in case extended shelf life beyond the expiry date is needed.
Precautions:
a. Do not store products in an environment containing corrosive elements, especially where chloride gas, sulfide gas, acid, alkali, salt or
the like are present. This may cause corrosion or oxidization of the terminations, which can easily lead to poor soldering.
b. Store products on the shelf and avoid exposure to moisture or dust.
c. Do not expose products to excessive shock, vibration, direct sunlight and so on.
Revision: 29-Jan-2021
Document Number: 45198
14
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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