VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
VJ…SE
Source Energꢃ
Cꢂpꢂcꢁtor (SEC)
Descrꢁptꢁon
[Mꢁn. V] [Mꢂx. V]
[Mꢁn.]
[Mꢂx.]
FEaTURES
1812
1825
2225
3040
3640
4044
4.7 nF
10 nF
18 nF
33 nF
47 nF
27 nF
• Surface-mount multilayer ceramic chip capacitor
• Low-electrostrictive ceramic formulation for
repeated charge and discharge cycles
• High pulse discharge currents
• Made with a combination of design, materials,
and tight process control to achieve very high
field reliability
• Available with tin-lead terminations (min. 4% lead)
• Excellent reliability and high-voltage performance
• Wet build process
56 nF
100 nF
220 nF
330 nF
X7R
1000
1500
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Power supplies
• Converter
• Voltage multiplier
100 nF
33 nF
560 nF
220 nF
FEaTURES
•
VJ Controꢀꢀed
Dꢁscꢄꢂrge
Cꢂpꢂcꢁtor (CDC)
Surface-mount multilyer ceramic chip capacitor with
integrated resistor
Low-electrostrictive ceramic formulation for repeated
charge and discharge cycles
3040
3640
4044
•
•
•
High pulse discharge currents
Made with a combination of design, materials,
and tight process control to achieve very high field
reliability
Available with tin-lead terminations (min. 4% lead)
Excellent reliability and high-voltage performance
Wet build process
47 nF
330 nF
X7R (Y5P)
1000
1500
•
•
•
•
Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
•
•
•
Detonation devices (munitions, pyrotechnic, blasting)
Down hole drilling
100 nF
1.0 pF
560 nF
Electronic fuzing
VJ 31/34
automotꢁve Serꢁes
FEaTURES
0402
0603
0805
1206
1210
1812
0402
0603
0805
1206
1210
1812
0402
0603
0805
1206
1210
25
50
100
200
500
220 pF
1.0 nF
3.9 nF
10 nF
12 nF
22 nF
47 nF
150 nF
470 nF
• Surface-mount multilayer ceramic chip capacitors
• AEC-Q200-qualified with PPAP available
• C0G (NP0) offers ultra-stable dielectric and low
power dissipation factor
• X7R operating temperature up to +150 °C, above
+125 °C with derating
• X8R maintains capacitance at high temperature
• AgPd terminations available for silver epoxy
bonding
• Polymer terminations in C0G (NP0)/X7R/X8R
available for increased resistance to board flex
cracking for size 0603 and larger
• Wet build process
C0G (NP0)
630
100 pF
12 pF
3000
100
200
500
120 pF
330 pF
16
50
25
X7R
X8R
220 pF
390 pF
10 nF
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
630
1.0 µF
• Timing and tuning circuits
• Filtering and decoupling
• Sensor and scanner applications
• Power supplies
330 pF
6.8 nF
33 nF
100
50
470 pF
100 nF
220 nF
390 nF
1.0 nF
10 nF
SELECTOR GUIDE
4/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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