是否Rohs认证: | 不符合 | 生命周期: | Transferred |
包装说明: | 15 X 17 MM, PLASTIC, BGA-165 | Reach Compliance Code: | compliant |
风险等级: | 5.87 | 最长访问时间: | 0.45 ns |
其他特性: | PIPELINED ARCHITECTURE | JESD-30 代码: | R-PBGA-B165 |
JESD-609代码: | e0 | 长度: | 17 mm |
内存密度: | 75497472 bit | 内存集成电路类型: | DDR SRAM |
内存宽度: | 18 | 功能数量: | 1 |
端子数量: | 165 | 字数: | 4194304 words |
字数代码: | 4000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 4MX18 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, LOW PROFILE | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 1.51 mm | 最大供电电压 (Vsup): | 1.9 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | TIN LEAD |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 15 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
UPD44644184F5-E37-FQ1-A | NEC |
获取价格 |
IC,SYNC SRAM,DDR,4MX18,CMOS,BGA,165PIN,PLASTIC |
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UPD44644184F5-E40-FQ1 | NEC |
获取价格 |
4MX18 DDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, PLASTIC, BGA-165 |
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UPD44644185F5-E37-FQ1 | RENESAS |
获取价格 |
IC,SYNC SRAM,DDR,4MX18,CMOS,BGA,165PIN,PLASTIC |
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UPD44644185F5-E37-FQ1-A | RENESAS |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 |
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UPD44644185F5-E40-FQ1 | RENESAS |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165 |
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UPD44644185F5-E50-FQ1 | RENESAS |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165 |
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UPD44644185F5-E50-FQ1-A | RENESAS |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 |
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UPD44644362AF5-E33-FQ1-A | RENESAS |
获取价格 |
2MX36 DDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 |
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UPD44644362F5-E37-FQ1 | RENESAS |
获取价格 |
DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165 |
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UPD44644362F5-E37-FQ1-A | RENESAS |
获取价格 |
2MX36 DDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 |
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