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U0805C102JNT PDF预览

U0805C102JNT

更新时间: 2022-02-26 09:05:31
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其他 - ETC /
页数 文件大小 规格书
19页 696K
描述
Multilayer Ceramic Capacitors

U0805C102JNT 数据手册

 浏览型号U0805C102JNT的Datasheet PDF文件第11页浏览型号U0805C102JNT的Datasheet PDF文件第12页浏览型号U0805C102JNT的Datasheet PDF文件第13页浏览型号U0805C102JNT的Datasheet PDF文件第15页浏览型号U0805C102JNT的Datasheet PDF文件第16页浏览型号U0805C102JNT的Datasheet PDF文件第17页 
Nickel Barrier  
Multilayer Ceramic Capacitors  
For Lead-free (Pure Tin plating termination) Termination component  
Essentially, the soldering temperature for Lead-free component is a little higher than that for Tin-Lead component, but need to take  
consideration of the thermal effect for all other components mounting on board at the same time. The below picture is a  
recommended soldering profile for Lead-free component  
Figure 8 Recommended Soldering Temperature Time Profile for Lead-free component (Reflow Soldering)  
Post soldering Cleaning  
(1)Residues of corrosive soldering fluxes on the PC board after cleaning may greatly have influences on the electrical characteristics  
and the reliability, (such as humidity resistance) of the Capacitors, which have been mounted on the board. It shall be confirmed that  
the characteristic and reliability at the devices are no effected by applied cleaning conditions.  
(2) Solubility of alternative cleaning solvent such as alcohol etc., is inferior to that of Freon cleaning solvent in the flux cleaning. So in  
case of alternative cleaning solvents, fresh cleaning solvent shall be used, and sufficient rinsing and drying shall carried out.  
(3) When an ultrasonic cleaning is applied to the mounted Capacitors on PC board, following conditions energy and the  
recommended for preventing failures or damages of the devices due to the large vibration energy and the resonant caused by the  
ultrasonic waves.  
Frequency  
Radiated Power :20 W/litre maximum.  
Period :5 minutes maximum.  
:29KHz maximum.  
Process Inspection  
When the mounted printed circuit are inspected with measuring terminal pins, abnormal and excess mechanical stresses shall not be  
applied to the PC board mounted components, to prevent failure or damages of the devices.  
(1) The mounted PC board shall be supported a same adequate supporting pins prevent their banding.  
(2) It shall be confirmed that the measuring pin have the right tip in shape, equal in height and are set in the tight positions.  
(3) The amount of adhesive shall be such that the adhesive dose flow off or be out of alignment.  
Protective Coating  
When the surface of a printed board on which the Capacitors has been mounted is coated with Resin to protect against moisture and  
dust, it shall be confirmed that the protective coat dose not have influences on reliability of the capacitors in the actual equipment.  
(1) Coating materials, such as being corrosive and chemically active, shall not be applied to the capacitors and other components.  
(2) Coating materials with a large expansively shall not be applied to the Capacitors for preventing failures or damages (such as  
cracking) of the devices in the curing process.  
Page 14  
27/04/06 V1.0  

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