Datasheet > U0404FC15C

U0404FC15C

更新时间： 2022-09-16 10:09:18

品牌	Logo	应用领域
PROTEC		/
页数	文件大小	规格书
6页	105K
描述
UNBUMPED FLIP CHIP ARRAY

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数据手册

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U0404FC15C 数据手册

U0404FC3.3C

thru

U0404FC36C

PACKAGE OUTLINE & DIMENSIONS

PACKAGE DIMENSIONS

MOUNTING PAD LAYOUT - Option 2

MILLIMETERS

DIM

INCHES

0.51

0.15 SQ

0.71

0.020

0.006 SQ

0.028

COPPER

CONTACTS

0.009” [0.23] DIA.

0.99

0.039

0.51

0.020

DIE

SOLDER

CONTACT

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and

outline: .xxx ± 0.05mm (± 0.002”).

3. Preferred: Using 0.1mm (0.004”) stencil.

Outline & Dimensions: Rev 3 - 9/04, 06024

TAPE & REEL ORIENTATION

Laser

Orientation

Line

SOLDER PRINT

0.014” - [0.36] DIA.

SOLDER MASK

Dual Die - 0404

NOTE:

1. Top view of tape. Solder bumps are face

down in tape package.

TAPE & REEL ORDERING NOMENCLATURE

1. Surface mount product is taped and

reeled in accordance with EIA 481.

2. 8mm Plastic Tape: 7 Inch Reels - 5,000

pieces per reel. Ordering Suffix: -T75-1

(i.e., U0404FC05C-T75-1).

3. 8mm Paper Tape: 7 Inch Reels - 10,000

pieces per reel. Ordering Suffix: -T710-2

(i.e., U0404FC05C-T710-2).

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical

characteristics described herein without notice (except JEDEC).

ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282

Tel: 602-431-8101 Fax: 602-431-2288

E-Mail: sales@protekdevices.com

Web Site: www.protekdevices.com

DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that

the final judgement concerning selection and specifications is the buyer’s and that in furnishing

engineering and technical assistance, ProTek assumes no responsibility with respect to the

selection or specifications of such products.

05159.R4 3/05

www.protekdevices.com

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