Datasheet > U0404FC15C

U0404FC15C

更新时间： 2022-09-16 10:09:18

品牌	Logo	应用领域
PROTEC		/
页数	文件大小	规格书
6页	105K
描述
UNBUMPED FLIP CHIP ARRAY

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数据手册

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U0404FC15C 数据手册

U0404FC3.3C

thru

U0404FC36C

PACKAGE OUTLINE & DIMENSIONS

PACKAGE DIMENSIONS

PACKAGE OUTLINE

MILLIMETERS

DIM

INCHES

0.56 NOM

0.86 NOM

1.0 ± 0.02

0.15 SQ

0.022 NOM

0.034 NOM

0.039 ± 0.001

0.006 SQ

TOP

1.0 ± 0.0254

0.406 NOM

0.039 ± 0.001

0.016 NOM

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and

outline: .xxx ± 0.05mm (± 0.002”).

Metalized Die Contacts

END

MOUNTING PAD LAYOUT - Option 1

PAD DIMENSIONS

MILLIMETERS

DIM

INCHES

0.51

0.30

0.46

0.20

0.15 SQ

0.71

0.020

0.012

0.018

0.008

0.006 SQ

0.028

DIE

SOLDER

CONTACT

0.99

0.51

0.039

0.020

NOTE:

1. Preferred: Using 0.1mm (0.004”) stencil.

SOLDER PADS

SOLDER PRINT

SOLDER MASK

0.010” - 0.012” DIA.

Outline & Dimensions: Rev 3 - 9/04, 06024

05159.R4 3/05

www.protekdevices.com

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