Datasheet > TSPC603EMGU3LN

TSPC603EMGU3LN

更新时间： 2023-01-02 23:59:45

品牌	Logo	应用领域
爱特美尔 - ATMEL		/
页数	文件大小	规格书
38页	632K
描述
RISC Microprocessor, 32-Bit, 100MHz, CMOS, CBGA255, CERAMIC, BGA-255

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TSPC603EMGU3LN 数据手册

TSPC603E

2.2. CBGA255 package

Figure3 (pin matrix) shows the pinout as viewed from the top of the CBGA package. The direction of the top surface view is shown by

the side profile of the CBGA package.

Pin matrix top view

01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16

Not to scale

Substrate Assembly

VIEW

Die

Encapsulant

Figure 3 : CBGA 255 Top view

5/38

1 2 3 456 7 8...38

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型号	品牌	描述	获取价格	数据表
TSPC603EMGU3ML	ATMEL	RISC Microprocessor, 32-Bit, 100MHz, CMOS, CBGA255, CERAMIC, BGA-255	获取价格
TSPC603EMGU5LL	ATMEL	RISC Microprocessor, 32-Bit, 133MHz, CMOS, CBGA255, CERAMIC, BGA-255	获取价格
TSPC603EMGU5ML	ATMEL	RISC Microprocessor, 32-Bit, 133MHz, CMOS, CBGA255, CERAMIC, BGA-255	获取价格
TSPC603EVA2LL	ATMEL	RISC Microprocessor, 32-Bit, 80MHz, CMOS, CQFP240, CERAMIC, QFP-240	获取价格
TSPC603EVA3LL	ATMEL	RISC Microprocessor, 32-Bit, 100MHz, CMOS, CQFP240, CERAMIC, LCC-240	获取价格
TSPC603EVA3ML	ATMEL	RISC Microprocessor, 32-Bit, 100MHz, CMOS, CQFP240, CERAMIC, LCC-240	获取价格