Datasheet > TSB1N21D3G75LV0EQT

TSB1N21D3G75LV0EQT

更新时间： 2025-09-16 18:33:51

品牌	Logo	应用领域
太诱 - TAIYO YUDEN		/
页数	文件大小	规格书
2页	360K
描述
多层陶瓷器件

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TSB1N21D3G75LV0EQT 数据手册

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Spec Sheet

Ceramic RF Devices (Band Pass Type)for 5G

(Previous PN: FI212B3750EQ-T)

TSB1N21D3G75LV0EQT

Features

Item Summary

Band Pass Type, 2.0x1.25x0.65mm

for LTE/5G

Lifecycle Stage

Mass Production (Preferred)

Standard packaging quantity (minimum)

Taping Embossed 5000pcs

Products characteristics table

System

External Dimensions

Dimension L

Dimension W

Dimension T

2.0 ±0.15 mm

LTE/5G

1.25 ±0.15 mm

Max 0.65 mm

Passband Frequency1 (f1)

Insertion Loss2 (max)(in f1)

VSWR1 (max)(in f1)

3300 to 4200 MHz

2 dB at 3300 to 4200MHz (-40 to +85 ℃)

2 at 3300 to 4200MHz

Attenuation1 (min)(f1)

Attenuation2 (min)(f1)

Input Impedance / Output Impedance

Operating Temp. Range

RoHS Compliance (10 subst.)

REACH Compliance (240 subst.)

Halogen Free

35 dB at 600 to 2700MHz

20 dB at 4900 to 5900MHz

50 Ω / 50 Ω

-40 to +85 ℃

Yes

Soldering

Reflow

2024.09.26

The data is reference only. Electrical characteristics vary depending on environment or measurement condition.

TAIYO YUDEN reserves the right to make change to the data at any time without notice.

Before making final selection, please check product specification.

http://www.ty-top.com

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