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TPS7510X PDF预览

TPS7510X

更新时间: 2024-09-22 04:27:27
品牌 Logo 应用领域
德州仪器 - TI 驱动器
页数 文件大小 规格书
15页 364K
描述
Low Dropout, Two-Bank LED Driver with PWM Brightness Control

TPS7510X 数据手册

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TPS7510x  
www.ti.com  
SBVS080CSEPTEMBER 2006REVISED MARCH 2007  
Low Dropout, Two-Bank LED Driver with PWM Brightness Control  
FEATURES  
DESCRIPTION  
Regulated Output Current with 2%  
LED-to-LED Matching  
The TPS7510x linear low dropout (LDO) matching  
LED current source is optimized for low power  
keypad and navigation pad LED backlighting  
applications. The device provides a constant current  
to up to four unmatched LEDs organized in two  
banks of two LEDs each in a common-cathode  
topology. Without an external resistor, the current  
source defaults to factory-programmable, preset  
current level with ±0.5% accuracy (typical). An  
optional external resistor can be used to set initial  
brightness to user-programmable values with higher  
accuracy. Brightness can be varied from off to full  
brightness by inputting a pulse width modulation  
(PWM) signal on each Enable pin. Each bank has  
independent enable and brightness control, but  
current matching is done to all four channels  
concurrently. The input supply range is ideally suited  
for single-cell Li-Ion battery supplies and the  
TPS7510x can provide up to 25mA per LED.  
Drives up to Four LEDs at 25mA Each in a  
Common Cathode Topology  
28mV Typical Dropout Voltage Extends  
Usable Supply Range in Li-Ion Battery  
Applications  
Brightness Control Using PWM Signals  
Two 2-LED Banks with Independent Enable  
and PWM Brightness Control per Bank  
No Internal Switching Signals—Eliminates EMI  
Default LED Current Eliminates External  
Components  
Default values from 3mA to 10mA (in 1mA  
increments) available using innovative  
factory EEPROM programming  
Optional external resistor can be used for  
high-accuracy, user-programmable current  
No internal switching signals are used, eliminating  
troublesome electromagnetic interference (EMI). The  
TPS7510x is offered in an ultra-small, 9-ball, 0.4mm  
ball-pitch wafer chip-scale package (WCSP) and a  
3mm × 3mm QFN package, yielding a very compact  
total solution size ideal for mobile handsets and  
portable backlighting applications. The device is fully  
specified over TJ = –40°C to +85°C.  
Over-Current and Over-Temperature  
Protection  
Available in Wafer Chip-Scale Package  
APPLICATIONS  
Keypad and Display Backlighting  
White and Color LEDs  
Cellular Handsets  
PDAs and Smartphones  
VBATT  
TPS7510x  
TPS7510x YFF  
9-Ball WCSP  
(Top View)  
VIN  
D1A  
VENA  
VENB  
ENA  
ENB  
D2A  
A3 B3  
A2 B2  
A1 B1  
C3  
C2  
C1  
D1B  
D2B  
ISET  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006–2007, Texas Instruments Incorporated  

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