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TPS50601VTDC2 PDF预览

TPS50601VTDC2

更新时间： 2024-10-02 01:03:31
品牌 Logo 应用领域
德州仪器 - TI 输入元件开关
页数 文件大小 规格书
5页 168K
描述
1.6-V TO 6.3-V INPUT, 6-A SYNCHRONOUS STEP DOWN SWIFT CONVERTER

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TPS50601VTDC2 技术参数

是否Rohs认证：不符合生命周期：Obsolete
包装说明：DIE-34Reach Compliance Code：not_compliant
Factory Lead Time：12 weeks风险等级：5.9
Is Samacsys：N模拟集成电路 - 其他类型：SWITCHING REGULATOR
控制模式：CURRENT-MODE最大输入电压：6.3 V
最小输入电压：1.6 VJESD-30 代码：R-XUUC-N34
长度：5.3563 mm功能数量：1
端子数量：34封装主体材料：UNSPECIFIED
封装代码：DIE封装形状：RECTANGULAR
封装形式：UNCASED CHIP表面贴装：YES
切换器配置：BUCK端子形式：NO LEAD
端子位置：UPPER宽度：2.0992 mm
Base Number Matches：1

TPS50601VTDC2 数据手册

 浏览型号TPS50601VTDC2的Datasheet PDF文件第2页浏览型号TPS50601VTDC2的Datasheet PDF文件第3页浏览型号TPS50601VTDC2的Datasheet PDF文件第4页浏览型号TPS50601VTDC2的Datasheet PDF文件第5页 
TPS50601-DIE  
www.ti.com  
SLVSC37 –JUNE 2013  
1.6-V TO 6.3-V INPUT, 6-A SYNCHRONOUS STEP DOWN SWIFT™ CONVERTER  
Check for Samples: TPS50601-DIE  
1
FEATURES  
2
•
Split Power Rail: 1.6 V to 6.3 V on PVIN  
•
•
Adjustable Slow Start and Power Sequencing  
•
•
Power Rail: 3 V to 6.3 V on VIN  
Power Good Output Monitor for Undervoltage  
and Overvoltage  
Flexible Switching Frequency Options:  
•
Adjustable Input Undervoltage Lockout  
–
–
–
Adjustable Internal Oscillator  
External Sync Capability  
APPLICATIONS  
Sync Pin Can Be Configured as a 500-kHz  
Output for Master/Slave Applications  
•
Point of Load Regulation  
•
Monotonic Start-Up into Pre-Biased Outputs  
DESCRIPTION  
The TPS50601-DIE is a 6.3-V, 6-A synchronous step down converter which is optimized for small designs  
through high efficiency and integrating the high-side and low-side MOSFETs. Further space savings are  
achieved through current mode control, which reduces component count, and a high switching frequency,  
reducing the inductor's footprint.  
The output voltage startup ramp is controlled by the SS/TR pin which allows operation as either a stand alone  
power supply or in tracking situations. Power sequencing is also possible by correctly configuring the enable and  
the open drain power good pins.  
Cycle by cycle current limiting on the high-side FET protects the device in overload situations and is enhanced  
by a low-side sourcing current limit which prevents current runaway. There is also a low-side sinking current limit  
which turns off the low-side MOSFET to prevent excessive reverse current. Thermal shutdown disables the part  
when die temperature exceeds thermal shutdown temperature.  
ORDERING INFORMATION(1)  
PACKAGE  
DESIGNATOR  
PRODUCT  
PACKAGE  
ORDERABLE PART NUMBER  
PACKAGE QUANTITY  
TPS50601VTDC1  
TPS50601VTDC2  
77  
10  
TPS50601  
TD  
Bare die in waffle pack(2)  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Processing is per the Texas Instruments space production baseline and is in compliance with the Texas Instruments Quality Control  
System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature  
only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual  
Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
SWIFT is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2013, Texas Instruments Incorporated  
12345

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