Datasheet > 消费电路 > 音频/视频放大器> TPA6136A2YFFR

TPA6136A2YFFR

更新时间： 2024-02-01 00:44:42

品牌	Logo	应用领域
德州仪器 - TI		消费电路商用集成电路音频放大器视频放大器 PC
页数	文件大小	规格书
22页	901K
描述
25-mW DIRECTPATH STEREO HEADPHONE AMPLIFIER WITH POP SUPPRESSION

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TPA6136A2YFFR 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	BGA
包装说明：	VFBGA, BGA16,4X4,16	针数：	16
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8542.33.00.01	Factory Lead Time：	1 week
风险等级：	5.21	Samacsys Confidence：
Samacsys Status：	Released	Schematic Symbol：	https://componentsearchengine.com/symbol.php?partID=607605
PCB Footprint：	https://componentsearchengine.com/footprint.php?partID=607605	Samacsys PartID：	607605
Samacsys Image：	https://componentsearchengine.com/Images/9/TPA6136A2YFFT.jpg	Samacsys Thumbnail Image：	https://componentsearchengine.com/Thumbnails/1/TPA6136A2YFFT.jpg
Samacsys Pin Count：	16	Samacsys Part Category：	Integrated Circuit
Samacsys Package Category：	Other	Samacsys Footprint Name：	BGA16C40P4X4_156X156X63
Samacsys Released Date：	2017-01-12 12:59:53	Is Samacsys：	N
标称带宽：	20 kHz	商用集成电路类型：	AUDIO AMPLIFIER
增益：	21.6 dB	谐波失真：	1%
JESD-30 代码：	S-PBGA-B16	JESD-609代码：	e1
长度：	1.905 mm	湿度敏感等级：	1
信道数量：	2	功能数量：	1
端子数量：	16	最高工作温度：	85 °C
最低工作温度：	-40 °C	标称输出功率：	0.025 W
封装主体材料：	PLASTIC/EPOXY	封装代码：	VFBGA
封装等效代码：	BGA16,4X4,16	封装形状：	SQUARE
封装形式：	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	峰值回流温度（摄氏度）：	260
电源：	3.6 V	认证状态：	Not Qualified
座面最大高度：	0.625 mm	子类别：	Audio/Video Amplifiers
最大压摆率：	2.9 mA	最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	2.3 V	表面贴装：	YES
温度等级：	INDUSTRIAL	端子面层：	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：	BALL	端子节距：	0.4 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	1.905 mm	Base Number Matches：	1

TPA6136A2YFFR 数据手册

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

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or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products

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Applications

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amplifier.ti.com

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DLP® Products

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Clocks and Timers

Interface

www.ti.com/automotive

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www.ti.com/digitalcontrol

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www.ti.com/military

www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

dsp.ti.com

www.ti.com/clocks

interface.ti.com

logic.ti.com

power.ti.com

microcontroller.ti.com

www.ti-rfid.com

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Power Mgmt

Microcontrollers

RFID

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Wireless

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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

1...19 20 2122

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