TLP166J
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Forward current
I
50
−0.7
1
mA
F
Forward current derating (Ta ≥ 53°C)
Peak forward current (100μs pulse, 100pps)
Reverse voltage
ΔI / °C
F
mA / °C
I
A
V
FP
V
5
R
Junction temperature
T
125
600
70
°C
V
j
Off−state output terminal voltage
V
DRM
Ta=25°C
On−state RMS Current
Ta=70°C
I
mA
T(RMS)
40
On−state current derating(Ta ≥ 25°C)
ΔI / °C
−0.67
2
mA / °C
A
T
Peak on−state current (100μs pulse, 120pps)
I
TP
Peak nonrepetitive surge current
(PW=10ms)
I
1.2
A
TSM
Junction temperature
Storage temperature range
Operating temperature range
Lead soldering temperature (10s)
T
115
−55 to 125
−40 to 100
260
°C
°C
j
T
stg
opr
T
°C
T
°C
sol
Isolation voltage (AC, 1min., R.H.≤ 60%)
(Note 2)
BV
2500
Vrms
S
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 2): Device considered a two−terminal device: Pins 1 and 3 shorted together and Pin 4 and 6 shorted together.
Recommended Operating Conditions
Characteristic
Symbol
Min
Typ.
Max
Unit
Supply voltage
Forward current
V
―
15
―
20
―
―
240
25
1
Vac
mA
A
AC
I
F
Peak on−state current
I
―
TP
Operating temperature
T
opr
−25
85
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
2
2010-10-01