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THS4304DBV PDF预览

THS4304DBV

更新时间: 2024-02-17 03:37:38
品牌 Logo 应用领域
德州仪器 - TI 运算放大器
页数 文件大小 规格书
26页 854K
描述
OP-AMP, 1000MHz BAND WIDTH, PDSO5, PLASTIC, MO-178, SOT-23, 5 PIN

THS4304DBV 技术参数

生命周期:Obsolete零件包装代码:MSOP
包装说明:PLASTIC, MSOP-8针数:8
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.72
Is Samacsys:N放大器类型:OPERATIONAL AMPLIFIER
标称共模抑制比:98 dBJESD-30 代码:S-PDSO-N8
长度:3 mm负供电电压上限:
标称负供电电压 (Vsup):功能数量:1
端子数量:8最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:HVSON封装形状:SQUARE
封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE认证状态:Not Qualified
座面最大高度:1 mm标称压摆率:700 V/us
子类别:Operational Amplifier供电电压上限:6.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
温度等级:INDUSTRIAL端子形式:NO LEAD
端子节距:0.65 mm端子位置:DUAL
标称均一增益带宽:1000000 kHz宽度:3 mm
Base Number Matches:1

THS4304DBV 数据手册

 浏览型号THS4304DBV的Datasheet PDF文件第1页浏览型号THS4304DBV的Datasheet PDF文件第3页浏览型号THS4304DBV的Datasheet PDF文件第4页浏览型号THS4304DBV的Datasheet PDF文件第5页浏览型号THS4304DBV的Datasheet PDF文件第6页浏览型号THS4304DBV的Datasheet PDF文件第7页 
THS4304  
www.ti.com  
SLOS436AMARCH 2004REVISED JULY 2004  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
PINOUT DRAWING  
TOP VIEW  
DBV  
TOP VIEW  
D and DGK  
+
V
V
1
2
5
4
NC  
IN−  
IN+  
NC  
S
1
2
3
4
8
7
6
5
OUT  
+
V
S
V −  
S
V
OUT  
IN+  
IN−  
3
V −  
S
V
OUT  
NOTE: NC indicates there is no internal connection to these pins.  
PACKAGING / ORDERING INFORMATION  
TRANSPORT MEDIA,  
QUANTITY  
PACKAGED DEVICES  
PACKAGE TYPE  
PACKAGE MARKINGS  
THS4304DBVT  
THS4304DBVR  
THS4304D  
Tape and Reel, 250  
Tape and Reel, 3000  
Rails, 75  
SOT-23-5  
AKW  
SOIC-8  
THS4304DR  
Tape and Reel, 2500  
Rails, 100  
THS4304DGK  
THS4304DGKR  
MSOP-8  
AKU  
Tape and Reel, 2500  
DISSIPATION RATINGS  
POWER RATING(2)  
θJC  
(°C/W)  
θJA  
PACKAGE  
(°C/W)(1)  
TA25°C  
391 mW  
1.02 W  
TA = 85°C  
156 mW  
410 mW  
221 mW  
DBV (5)  
D (8)  
55  
255.4  
97.5  
38.3  
71.5  
DGK (8)  
180.8  
553 mW  
(1) This data was taken using the JEDEC standard High-K test PCB.  
(2) Power rating determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal  
management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long-term  
reliability.  
2

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