Datasheet > THS4304_14

THS4304_14

更新时间： 2022-10-12 16:22:34

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
26页	854K
描述
Wideband Operational Amplifier

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THS4304_14 数据手册

THS4304

www.ti.com

SLOS436A–MARCH 2004–REVISED JULY 2004

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

PINOUT DRAWING

TOP VIEW

DBV

TOP VIEW

D and DGK

IN−

IN+

OUT

V −

OUT

IN+

IN−

V −

OUT

NOTE: NC indicates there is no internal connection to these pins.

PACKAGING / ORDERING INFORMATION

TRANSPORT MEDIA,

QUANTITY

PACKAGED DEVICES

PACKAGE TYPE

PACKAGE MARKINGS

THS4304DBVT

THS4304DBVR

THS4304D

Tape and Reel, 250

Tape and Reel, 3000

Rails, 75

SOT-23-5

AKW

SOIC-8

—

THS4304DR

Tape and Reel, 2500

Rails, 100

THS4304DGK

THS4304DGKR

MSOP-8

AKU

Tape and Reel, 2500

DISSIPATION RATINGS

POWER RATING⁽²⁾

θ_JC

(°C/W)

θ_JA

PACKAGE

(°C/W)⁽¹⁾

T_A≤ 25°C

391 mW

1.02 W

T_A= 85°C

156 mW

410 mW

221 mW

DBV (5)

D (8)

255.4

97.5

38.3

71.5

DGK (8)

180.8

553 mW

(1) This data was taken using the JEDEC standard High-K test PCB.

(2) Power rating determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal

management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long-term

reliability.

123 4 5 6 7...26

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