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TDA8357 PDF预览

TDA8357

更新时间: 2024-02-13 12:31:57
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
16页 100K
描述
Full bridge vertical deflection output circuit in LVDMOS

TDA8357 技术参数

是否Rohs认证: 符合生命周期:Transferred
包装说明:ZIP, ZIP9,.2Reach Compliance Code:unknown
风险等级:5.6商用集成电路类型:VERTICAL DEFLECTION IC
JESD-30 代码:R-PZIP-T9JESD-609代码:e3
端子数量:9最高工作温度:70 °C
最低工作温度:-25 °C封装主体材料:PLASTIC/EPOXY
封装代码:ZIP封装等效代码:ZIP9,.2
封装形状:RECTANGULAR封装形式:IN-LINE
电源:12 V认证状态:Not Qualified
子类别:Deflection ICs表面贴装:NO
技术:BCDMOS温度等级:OTHER
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子节距:1.27 mm端子位置:ZIG-ZAG
Base Number Matches:1

TDA8357 数据手册

 浏览型号TDA8357的Datasheet PDF文件第2页浏览型号TDA8357的Datasheet PDF文件第3页浏览型号TDA8357的Datasheet PDF文件第4页浏览型号TDA8357的Datasheet PDF文件第5页浏览型号TDA8357的Datasheet PDF文件第6页浏览型号TDA8357的Datasheet PDF文件第7页 
INTEGRATED CIRCUITS  
DATA SHEET  
TDA8357J  
Full bridge vertical deflection output  
circuit in LVDMOS  
Preliminary specification  
1999 Nov 10  
File under Integrated Circuits, IC02  

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